图书馆主页
数据库简介
最新动态
联系我们



返回首页


 刊名字顺( Alphabetical List of Journals):

  A|B|C|D|E|F|G|H|I|J|K|L|M|N|O|P|Q|R|S|T|U|V|W|X|Y|Z|ALL


  检 索:         高级检索

期刊名称:ADVANCED COMPOSITES AND HYBRID MATERIALS

ISSN:2522-0128
出版频率:Quarterly
出版社:SPRINGERNATURE, CAMPUS, 4 CRINAN ST, LONDON, ENGLAND, N1 9XW
  出版社网址:https://www.springernature.com/cn
期刊网址:https://www.springer.com/journal/42114
影响因子:5.693
主题范畴:NANOSCIENCE & NANOTECHNOLOGY;    MATERIALS SCIENCE, COMPOSITES
变更情况:Newly Added by 2020

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

Aims and scope

Advanced Composites and Hybrid Materials provides an international interdisciplinary platform for rapid scientific communication among materials scientists, engineers, chemists, biologists, and physicists working on composites and, in particular, nanocomposites. The journal publishes top-level research on materials design, surface and interface science/engineering, manufacturing, structure control, property design, and device fabrication and other applications as well as related simulation/modeling studies. Papers on the relationship between the fillers and the matrix are of particular interest. The journal encompasses polymer, metal, and ceramic matrices, with particular interest in reviews and meta-analyses on materials selection. Coverage includes transport properties; strategies for controlling interfaces and composition distribution; bottom-up assembly of nanocomposites; highly porous and high-density composites; electronic structure design; materials synergisms; and thermoelectric materials.

Advanced Composites and Hybrid Materials is a single-blind peer reviewed journal.


Instructions to Authors

 


Editorial Board

Editor-in-Chief:

Zhanhu Guo, University of Tennessee, Knoxville, USA

 

Associate Editors:

Junwei Gu, Northwestern Polytechnical University, China

Chuntai Liu, Zhengzhou University, China

Roberto Scaffaro, University of Palermo, Italy

Lu Shao, Harbin Institute of Technology, China

Ning Wang, Hainan University and University of Electronic Science and Technology of China, China

Evan K. Wujcik, The University of Alabama, USA

 

Editorial Board:

Antonio Abate, Helmholtz-Zentrum Berlin, Germany; Ramazan Asmatulu, Wichita State University, USA; Juan Ruso Beiras, University of Santiago de Compostela (USC), Spain; Robert Brull, Fraunhofer Institute for Durability and System Reliability LBF, Germany; Dapeng Cao, Beijing University of Chemical Technology, China; Shougang Chen, Ocean University of China, China; Yuan Chen, The University of Sydney, Australia; Daniel Choi,Masdar Institute, UAE; Henry A. Colorado, Universidad de Antioquia, Colombia; Kun Dai,Zhengzhou University, China; Ai Du, Tongji University, China; Runhua Fan, Shanghai Maritime University, China; Chuanliang Feng, Shanghai Jiaotong University, China; Jihua Gou, University of Central Florida, USA; Hongbo Gu, Tongji University, China; Zhiyong Gu, University of Massachusetts Lowell, USA; Nikhil Gupta, New York University, USA; Vinod Kumar Gupta, University of Johannesburg, South Africa; Xiao (Matthew) Hu,Nanyang Technological University, Singapore; Jijun Huang, The University of Chinese Academy of Sciences, China; Jin Huang, Southwest University, China; Xingyi Huang,Shanghai Jiao Tong University, China; Ju-Won Jeon, Kookmin University, South Korea; Jenna Jia, University of Regina, Canada; Bo Jiang, Harbin Institute of Technology, China; Dawei Jiang, Northeast Forestry University, China; Qinglong Jiang, Argonne National Laboratory, USA; Zhongyi Jiang, Tianjin University, China; Hak-Sung Kim, Hanyang University, Republic of Korea; Jie Kong, Northwestern Polytechnical University, China; Xiaolin Li, Pacific Northwest National Laboratory, USA; Yan Li, Tongji University, China; Yao Li, Harbin Institute of Technology, China; Ying Li, Texas A&M University, USA; Hong Lin, Tsinghua University, China; Hongfei Lin, Washington State University, USA; Chuntai Liu, Zhengzhou University, China; Jiurong Liu, Shandong University, China; Yuyan Liu, Harbin Institute of Technology, China; Zhen Liu, Frostburg State University, USA; Na Luna Lu, Purdue University, USA; Weibang Lu, Chinese Academy of Sciences, China; Zhengtang Luo, The Hong Kong University of Science and Technology, Hong KongCunjing Lv, Tsinghua Univeristy, China; Nurxat Nuraje, Texas Tech University. Lubbock, USA; Dermot O'Hare, University of Oxford, UK; Kristiina Oksman, Luleå University of Technology, Sweden; Giuseppe Palmese, Drexel University, USA; Elizabeth Podlaha,Clarkson University, USA; Vilas G. Pol, Purdue University, USA; Faxiang Qin, Zhejiang University, China; Zuzeng Qin, Guangxi University, China; Bin Qiu, Beijing Forestry University, China; Jong Eun Ryu, Indiana University, Indianapolis (IUPUI), USA; Changyu Shen, Zhengzhou University, China; T. D. Shen, Yanshan University, China; Haixiang Song, Anyang Institute of Technology, China; A. Subramania, Pondicherry University, India; Luyi Sun, University of Connecticut, USA; Rong Sun, Chinese Academy of Sciences, China; Sruthi Tadakamalla, Sep-Pro Systems Inc., USA; Bo Wang, Dalian University of Technology, China; Chun H. Wang, University of New South Wales, Australia; Qiang Wang, Beijing Forestry University, China; Zhe Wang, Oakland University, USA; Huige Wei, Tianjin University of Science and Technology, China; Di Wu, Washington State University, USA; Deying Xia, Carl Zeiss Microscopy, LLC, USA; Chao Yan, Jiangsu University of Science and Technology; Guang Yang, Huazhong University of Science & Technology; Liu Yang, University of Strathclyde, UK; Peng Yang, Shaanxi Normal University, China; Wei Yang, Sichuan University, China; Narendranath Yerra, JGC America Inc., USA; Robert Young, Lancaster University, UK; Guoping Zhang, Chinese Academy of Sciences, China; Qiuyu Zhang, Northwestern Polytechnical University, China; Xin Zhang, Pacific Northwest National Laboratory, USA; Chunyi Zhi, City University of Hong Kong, Hong Kong; Haizheng Zhong, Beijing Institute of Technology, China; Katie Zhong, Washington State University, USA; Jack Jiahua Zhu, The University of Akron, USA; Yutian Zhu, Chinese Academy of Sciences, China.

 

Promotional & Coordinating Offices:

Ge Yang, Chongqing and Hainan, China
Jiangchuan Zhou, Chongqing, China



 返回页首 


邮编:430072   地址:中国武汉珞珈山   电话:027-87682740   管理员Email:
Copyright © 2005-2006 武汉大学图书馆版权所有