期刊名称:VIRTUAL AND PHYSICAL PROTOTYPING
期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
Aims and scope
Virtual and Physical Prototyping is online only. We welcome authors to submit supplementary data sets, colour images, animation and videos to publish with your articles to enhance the content experience of the journal.
Virtual and Physical Prototyping provides an international forum for professionals and academics to exchange novel ideas and disseminate knowledge covering the full range of activities related to the multi-disciplinary area of virtual and rapid prototyping.
The scope of VPP includes:
- Design for additive manufacturing: topological optimisation, lightweight, biomimetic design, functionally graded structures, etc.
- 4D printing: smart materials, shape memory polymers/alloys, deployable structures, etc.
- Multi-material printing: 3D printing of multiple metals, polymers, ceramics, composites, etc.
- Hybrid manufacturing: combination of additive and subtractive technologies
- Functional 3D printing: functional design, functional prototyping, etc.
As well as the following topics:
- CAD and 3D data acquisition technologies
- Virtual environments and virtual reality
- Rapid tooling and rapid manufacturing
- Quality control and AM standards
- Concurrent engineering
- Bioprinting and biofabrication
- Concrete printing
- Miscellaneous: e-manufacturing/Internet of things, legal perspectives, economics, social and environmental implications, case studies, etc.
All published research articles in this journal have undergone rigorous peer review, based on initial editor screening and anonymous refereeing by independent expert referees.
irtual and Physical Prototyping is abstracted and indexed in: Science Citation Index Expanded; British Library Inside; Cambridge Scientific Abstracts; Compendex, EBSCO Databases; Electronic Collections Online; Engineering Index (Compendex); Inspec; New Jour; OCLC; Scopus and Zetoc.
Instructions to Authors
Editorial Board
Editor-in-Chief: Chee Kai Chua - Engineering Product Development (EPD), Singapore University of Technology and Design, Singapore
Founding Editor: Paulo Jorge da Silva Bártolo - School of Mechanical, Aerospace and Civil Engineering, The University of Manchester, UK Fax: +351 244 820 310 ![Call: +351 244 820 310](data:image/png;base64,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)
Associate Editors: Wai Yee Yeong - Nanyang Technological University, Singapore
Assistant Editor: Jia An - Nanyang Technological University, Singapore
Editorial Board Members: Alain Bernard - Ecole Centrale de Nantes, France Anath Fischer - Technion-Israel Institute of Technology, Israel Bopaya Bidanda - University of Pittsburgh, USA Cijun Shuai - Central South University, Changsha, People’s Republic of China David Bourell - University of Texas at Austin, USA David Dean - Ohio State University, USA Jack Zhou - Drexel University, USA Ian Gibson - Deakin University, Australia Jiankang He - Xi’an Jiaotong University, Xi’an, People’s Republic of China John Lewandowski - Case Western Reserve University, USA Martin Dunn - University of Colorado, USA Ming Leu - Missouri University of Science and Technology, USA Shoufeng Yang - University of Southampton, UK Shlomo Magdassi - The Hebrew University of Jerusalem, Israel Yong Chen - University of Southern California, USA Kun Zhou - Nanyang Technological University, Singapore Yongqiang Yang - South China University of Technology, People's Republic of China Pan Wang - Singapore Institute of Manufacturing Technology, Singapore
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