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期刊名称：EXTREME MECHANICS LETTERS ISSN： 2352-4316 出版频率： Bi-monthly 出版社： ELSEVIER, RADARWEG 29, AMSTERDAM, NETHERLANDS, 1043 NX   出版社网址： https://www.elsevier.com/zh-cn 期刊网址： https://www.journals.elsevier.com/extreme-mechanics-letters 影响因子： 4.567 主题范畴： MATERIALS SCIENCE, MULTIDISCIPLINARY;    MECHANICS 变更情况： Newly Added by 2019 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal Extreme Mechanics Letters (EML) enables rapid communication of research that highlights the role of mechanics in multi-disciplinary areas across materials science, physics, chemistry, biology, medicine and engineering. Emphasis is on the impact, depth and originality of new concepts, methods and observations at the forefront of applied sciences. EML publishes letter-sized articles, as well as invited reviews and articles on topics of special interest. The goal is to have the papers published online within 6-8 weeks upon submission. EML covers experimental, theoretical, and computational mechanics of processes at all size and time scales. Of particular interest is the progress in mechanics that advances the fields of vital importance to the society, including, but not limited to, health science, energy systems, the environment, food and water, climate, and security. Among the topical areas of interest are: • Materials of extreme properties, such as exceptional hardness or softness • Materials under extreme conditions, such as high temperature and high loading rate • Stretchable, wearable, or implantable electronics for entertainment or healthcare • Soft robots in manufacturing, surgery and assisted living • Robots that crawl, run, swim or fly • Biomimetics that perceive, act, learn and remember • Active materials in response to mechanical, chemical, electrical, thermal stimuli • Instability and large deformation in nature and engineering systems • Force-induced configurational changes of proteins leading to cascades in cellular responses • Deformation, transport and fracture in high-efficiency batteries • Interfacial phenomena in interactions between fluids and solids, deformation and failure of materials, and processes of living cells • Self-assembly of materials and devices • Thin-membrane origami and kirigami • Mechanics of 3D printing • Materials and structures of hierarchical architectures • Hybrid systems of air, liquids, and solids • Earthquakes and hydraulic fracture • Foldable, lightweight structures for space exploration   Abstracting and Indexing Science Citation Index Expanded INSPEC Instructions to Authors • Your Paper Your Way • Submission checklist BEFORE YOU BEGIN • Ethics in publishing • Declaration of interest • Submission declaration and verification • Use of inclusive language • Author contributions • Changes to authorship • Copyright • Role of the funding source • Open access • Submission PREPARATION • New Submission • Peer review • REVISED SUBMISSIONS • Article structure • Essential title page information • Highlights • Abstract • Keywords • Artwork • Tables • References • Video • Supplementary material • Research data AFTER ACCEPTANCE • Online proof correction • Offprints AUTHOR INQUIRIES Instructions to Authors 734457.pdf Editorial Board Editors-in-Chief K. J. Hsia Nanyang Technological University, SingaporeEmail K. J. Hsia J. A. Rogers Northwestern University Department of Materials Science and Engineering, Evanston, Illinois, United StatesEmail J. A. Rogers Z. Suo, PhD Harvard University John A Paulson School of Engineering and Applied Sciences, Cambridge, Massachusetts, United StatesEmail Z. Suo, PhD Associate Editors K. Bertoldi, PhD Harvard University John A Paulson School of Engineering and Applied Sciences, Cambridge, Massachusetts, United StatesEmail K. Bertoldi, PhD H. Jiang Arizona State University Department of Mechanical and Aerospace Engineering, Tempe, Arizona, United StatesEmail H. Jiang T. Li University of Maryland at College Park A James Clark School of Engineering, College Park, Maryland, United StatesEmail T. Li M. Sitti Max Planck Institute for Intelligent Systems Department of Physical Intelligence, Stuttgart, GermanyEmail M. Sitti S. Zhang The Pennsylvania State University Department of Engineering Science and Mechanics, University Park, Pennsylvania, United StatesEmail S. Zhang Advisory Board M. C. Boyce Columbia University, New York, New York, United States L. B. Freund Brown University, Providence, Rhode Island, United States H. Gao, PhD Nanyang Technological University College of Engineering, Singapore, Singapore Y. Huang Northwestern University, Evanston, Illinois, United States J. W. Hutchinson Harvard University, Cambridge, Massachusetts, United States D. E. Ingber Harvard University Wyss Institute for Biologically Inspired Engineering, Boston, Massachusetts, United States S. Kyriakides The University of Texas at Austin, Austin, Texas, United States S. Suresh Carnegie Mellon University, Pittsburgh, Pennsylvania, United States J. A. Todd Pennsylvania State University, University Park, Pennsylvania, United States V. Tvergaard Technical University of Denmark, Kgs Lyngby, Denmark G. M. Whitesides Harvard University, Cambridge, Massachusetts, United States W. Yang Zhejiang University, Hangzhou, China Editorial Board I. A. Anderson The University of Auckland Auckland Bioengineering Institute, Auckland, New Zealand B. Audoly Solid Mechanics Laboratory, Palaiseau, France S. Bauer Johannes Kepler University Linz, Linz, Austria M. J. Buehler Massachusetts Institute of Technology, Cambridge, Massachusetts, United States F. Carpi Queen Mary University of London, London, United Kingdom D. Fang Beijing Institute of Technology, Beijing, China X. Guo Dalian University of Technology, Dalian, China H. T. Johnson University of Illinois at Urbana-Champaign, Champaign, Illinois, United States S. P. Lacour Federal Polytechnic School of Lausanne, Lausanne, Switzerland J. Li Massachusetts Institute of Technology, Cambridge, Massachusetts, United States C. T. Lim National University of Singapore, Singapore M. C. McAlpine University of Minnesota, Minneapolis, Minnesota, United States P. R. Onck University of Groningen, Groningen, Netherlands M. L. Oyen University of Cambridge, Cambridge, United Kingdom B. L. Pruitt Stanford University, Stanford, California, United States P. M. Reis Massachusetts Institute of Technology, Cambridge, Massachusetts, United States B. Roman Laboratory of Physics and Mechanics of Heterogeneous Media, Paris, France M. T. A. Saif University of Illinois at Urbana-Champaign, Champaign, Illinois, United States K. J. Van Vliet, PhD Massachusetts Institute of Technology Department of Materials Science and Engineering, Cambridge, Massachusetts, United States Q. Zheng Tsinghua University, Beijing, China T. Zhu Georgia Institute of Technology, Atlanta, Georgia, United States