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期刊名称:COLLOID AND INTERFACE SCIENCE COMMUNICATIONS

ISSN:2215-0382
出版频率:Bi-monthly
出版社:ELSEVIER, RADARWEG 29, AMSTERDAM, NETHERLANDS, 1043 NX
  出版社网址:https://www.elsevier.com/zh-cn
期刊网址:https://www.journals.elsevier.com/colloid-and-interface-science-communications
影响因子:4.914
主题范畴:CHEMISTRY, PHYSICAL;    NANOSCIENCE & NANOTECHNOLOGY;    MATERIALS SCIENCE, COATINGS & FILMS
变更情况:Newly Added by 2018

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

1st issue published in August 2014


Instructions to Authors

All journal information and instructions compiled in one document (PDF) in just one mouse-click Author information pack

• Your Paper Your Way
• Types of Paper
• Submission checklist
BEFORE YOU BEGIN
• Ethics in publishing
• Declaration of interest
• Submission declaration and verification
• Use of inclusive language
• Changes to authorship
• Copyright
• Role of the funding source
• Open access
• Submission
• Referees
PREPARATION
• NEW SUBMISSIONS
• Formatting requirements
• Peer review
• REVISED SUBMISSIONS
• ARTICLE STRUCTURE
• Essential title page information
• Artwork
• Tables
• Video
• Supplementary material
• Research data
AFTER ACCEPTANCE
• Online proof correction
• Offprints
AUTHOR INQUIRIES

Instructions to Authors
731952.pdf

Editorial Board
Editor

Qian Yu

Soochow University, Suzhou, Jiangsu Province, China
Board Members

K. G. Ayappa

Indian Institute of Science, Bangalore, India

S. Biggs

University of Queensland, Brisbane, Queensland, Australia

L.B. Boinovich

A.N Frumkin Institute of Physical Chemistry and Electrochemistry, Moscow, Russian Federation

D. Brutin

Aix-Marseille Université, Marseille, France

H.J. Busscher

Rijksuniversiteit Groningen, Groningen, Netherlands

N Denkov

University of Sofia, Sofia, Bulgaria

V.K. Gupta

Indian Institute of Technology (IIT) Roorkee, Roorkee, India

Y. Hanein

Tel Aviv University, Tel Aviv, Israel

T.A. HATTON

Massachusetts Institute of Technology, Cambridge, Massachusetts, USA

N. Hilal

Swansea University, Swansea, Wales, UK

Q. Huo

University of Central Florida, Orlando, Florida, USA

J. Jiang

National University of Singapore, Singapore

K. Kaneko

Shinshu University, Nagano-city, Japan

S. Kaskel

Technische Universität Dresden, Dresden, Germany

A.B Kayitmazer

Bogazici University, Istanbul, Turkey

S. Kitagawa

Kyoto University, Kyoto, Japan

M Kosmulski

Lublin University of Technology , Lublin, Poland

M. E. Leser

Nestec Ltd., Lausanne 26, Switzerland

P. Levitz

Université Pierre et Marie Curie, Paris, France

J. Liu

Pacific Northwest National Laboratory, Richland, Washington, USA

M. Malmsten

University of Copenhagen, Copenhagen Ø, Denmark

S. Minko

University of Georgia, Athens, Georgia, USA

W. Parak

Philipps-Universität Marburg, Marburg, Germany

D. Prieve

Carnegie Mellon University, Pittsburgh, Pennsylvania, USA

A.D. Rey

McGill University, Montreal, Quebec, Canada

G. Scherer

Princeton University, Princeton, New Jersey, USA

S. Seeger

Universität Zürich, Zurich, Switzerland

N. Shapley

Rutgers University, Piscataway, New Jersey, USA

V.M. Starov

Loughborough University, Loughborough, UK

K.J. Stebe

University of Pennsylvania, Philadelphia, Pennsylvania, USA

B.-L. Su

Université de Namur, Namur, Belgium

L.Z. Wang

University of Queensland, St Lucia, Brisbane, Australia

D. Y. Zhao

Fudan University, Shanghai, China


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