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期刊名称:IEEE CONSUMER ELECTRONICS MAGAZINE

ISSN:2162-2248
出版频率:Bi-monthly
出版社:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
  出版社网址:https://ieeexplore.ieee.org/Xplore/home.jsp
期刊网址:https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=5962380
影响因子:3.789
主题范畴:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE;    ENGINEERING, ELECTRICAL & ELECTRONIC;    TELECOMMUNICATIONS
变更情况:Newly Added by 2017

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

Aims & Scope

The scope covers the following areas that are related to “consumer electronics” and other topics considered of interest to consumer electronics: Video technology, Audio technology, White goods, Home care products, Mobile communications, Gaming, Air care products, Home medical devices, Fitness devices, Home automation & networking devices, Consumer solar technology, Home theater, Digital imaging, In Vehicle technology, Wireless technology, Cable & satellite technology, Home security, Domestic lighting, Human interface, Artificial intelligence, Home computing, Video Technology, Consumer storage technology.

Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=5962380More »

Frequency: 6

Subjects

  • Communication, Networking & Broadcasting
  • Components, Circuits, Devices & Systems
  • Computing & Processing
  • Power, Energy, & Industry Applications

Instructions to Authors

Submissions should follow IEEE standard template and should consist of the followings: (i) A manuscript of maximum 6-page length: A pdf of the complete manuscript layout with figures, tables placed within the text, and (ii) Source files: Text should be provided separately from photos and graphics and may be in Word or LaTeX format. High resolution original photos and graphics are required for the final submission. Images embedded in Word or Excel documents are not suitable; however, figures and graphics may be provided in a PowerPoint slide deck, with one figure/graphic per slide.

The authors must own the copyright on any images, photographs or graphics or have obtained explicit permission for use of all such material when a third party owns the copyright. Alternatively, copy left images and materials may be used once the relevant license terms are complied with, including citations to the original source/author. It is the responsibility of the author(s) to demonstrate such compliance and document the corresponding license agreements (a URL is sufficient) in notes accompanying the submitted article. The authors should include a PDF file with a suggested layout of the article. Figure captions must be provided and ideally figures/graphics should be cited in the text of the article.

An IEEE copyright form will be required. The manuscripts need to be submitted online using the following URL:http://mc.manuscriptcentral.com/cemag. This ScholarOne site will automate the generation of a single submission document if the authors have the correct files prepared in advance.


Editorial Board
Saraju P. Mohanty, University of North Texas, Editor-in-Chief (EiC) 
Peter Corcoran, National University of Ireland Galway, Emeritus EiC 
Katina Michael, University of Wollongong
Pallab Chatterjee, Media & Entertainment Technologies
Stu Lipoff, IP Action Partners LLC
Anirban Sengupta, Indian Institute of Technology Indore
Tom Coughlin, Coughlin Associates 
Stephen Dukes, Imaginary Universes LLC 
Helen (Hai) Li, Duke University 
Himanshu Thapliyal, University of Kentucky 
Soumya Kanti Datta, EURECOM Research Center 
Fabrizio Lamberti, Politecnico di Torino 
Tom Wilson, Tandem Launch Inc., Montreal 
Robin Bradbeer, Pearl Technologies Ltd, Hong Kong 
Konstantin Glasman, Saint Petersburg State University of Film and Television 
Bernard Fong, Automotive Parts and Accessory Systems R&D Centre 
Animesh Kumar, Indian Institute of Technology Bombay 
Vincent Wang, DTS Inc., Singapore Technology Center 
Euee S. Jang, Hanyang University 
Petronel Bigioi, FotoNation Ltd. 
Hyoungshick Kim, Sungkyunkwan University 
Jong-Hyouk Lee, Sangmyung University 
Shiyan Hu, Michigan Technological University 
Theocharis Theocharides, University of Cyprus 
Niranjan Ray, KIIT University, Bhubaneswar 
Xavier Fernando, Ryerson University 
Bob Frankston, Frankston.com 
Sergio Saponara, University of Pisa 
Arslan Munir, Kansas State University 
Hitten Zaveri, Yale University 
Muhammad K. Khan, King Saud University 
Deepak Puthal, University of Technology Sydney 
Fatemeh Tehranipoor, San Francisco State University 
Sudeep Pasricha, Colorado State University 
Shanq-Jang Ruan, National Taiwan University of Science & Technology (NTUST) 
Santanu Mishra, Indian Institute of Technology Kanpur 
Bijaya K. Panigrahi, Indian Institute of Technology Delhi 
Madhavi Ganapathiraju, University of Pittsburgh 
Amit K. Mishra, University of Cape Town 
Dhruva Ghai, Oriental University 
Wahab Almuhtadi, Algonquin College
Haruhiko Okumura, Toshiba Corporation
Upasna Vishnoi, Marvell Semiconductor Inc. 
Sally Applin, University of Kent 
Yu Yuan, CATE Global Corporation 
Susanne Wende, Noerr LLP 
Joseph Wei, SJW Consulting Inc. 
Mike Borowczak, University of Wyoming
Abdullah S. Almuttiri, Nokia Al-Saudia, Riyadh
Ezendu Ariwa, University of Bedfordshire


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