NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING
***Note to Authors: please make sure your contact address information is clearly visible on the outside of all packages you are sending to Editors.***
Categories for Contribution
Each issue of Nanoscale and Microscale Thermophysical Engineering will consist of one or two Review Articles, several Reports, Letters, and Technical Discussions. Priority will be given to papers that reveal novel concepts and provide new physical insight. All contributions will be peer reviewed.
Review Articles. Papers in this category will review new developments in the field. They should be, at most, 6,000 words. (When allowing for art, please allow for half a page per piece or 230 words.) The papers should emphasize firmly established knowledge of the field, as well as discuss unresolved issues and/or future directions. Both solicited and unsolicited papers will undergo peer review. The review articles should include an abstract of a maximum of 150 words, an introduction, and sections with brief subheadings.
Reports. Reports should be, at the most, 3,000 words. They should present important new research results. Reports should include an abstract of a maximum of 100 words.
Letters. Letters to the editor should contain less than 400 words and should discuss material published in the journal or problems of general interest.
Technical Discussion. Technical discussions can be of two types (i) The first will focus on papers that are published in this journal. For example, high-quality reviews, as well as responses from authors that are insightful and intellectually stimulating, will be presented in this category. (ii) The second type will discuss new contributions in the area of microscale thermophysical engineering that appear in other journals. These could be comments by the editors or contributions by others. Technical discussions should not exceed 500 words.
Submission of Manuscripts
Manuscripts should be sent to Professor Arunava Majumdar, Editor-in-Chief, Microscale Thermophysical Engineering, 6147 Etcheverry Hall, UC Berkeley, Berkeley , CA 94720. Authors are strongly encouraged to submit manuscripts on disk. The disk should be prepared using MS Word or WordPerfect and should be clearly labeled with the authors' names, file name, and software program. A hardcopy printout that exactly matches the disk must be supplied.
Each manuscript must be accompanied by a statement that it has not been published elsewhere and that it has not been submitted simultaneously for publication elsewhere. Authors are responsible for obtaining permission to reproduce copyrighted material from other sources and are required to sign an agreement for the transfer of copyright to the publisher. All accepted manuscripts, artwork, and photographs become the property of the publisher.
All parts of the manuscript should be typewritten, double-spaced, with margins of at least one inch on all sides. Number manuscript pages consecutively throughout the paper. Authors should also supply a shortened version of the title suitable for the running head, not exceeding 50 character spaces. Each article should be summarized in an abstract of no more than 100 words. Avoid abbreviations, diagrams, and reference to the text.
Affiliations
Authors should provide their full last names, as well as their first and other initials. They should also provide the affiliation and address of each author. A footnote should be provided for the corresponding author saying "To whom correspondence should be addressed." The mailing address, telephone and fax numbers, and e-mail address of the corresponding author should also be provided.
Nomenclature
A separate nomenclature section at the end of the paper should list in detail the symbols used in the manuscript, their definitions, and their units. The nomenclature list should be in alphabetical order with Greek symbols following the alphabetical listing. Subscripts and superscripts should follow Greek symbols and should be identified with a heading. Units should be included only when necessary for the understanding of the textual material. To indicate units involving fractions, slashes should be used. The SI system should be used throughout, with the appropriate prefixes.
References
References to cited literature should be identified by number in the text in square brackets and full citations should be grouped at the end of the paper in numerical order of appearance. Double-spacing must be used throughout. Each reference should be listed only once. References that are always cited together may be grouped under a single number. References should be styled and punctuated according to the following examples:
Journal Article: S.C. Chen and K. Vafai, Analysis of Free Surface Momentum and Energy Transport in Porous Media, Numerical Heat Transfer, Part A, vol.29, pp. 281-296, 1996.
Book: A. Faghri, Heat Pipe Science and Technology, Taylor & Francis, Washington, D.C., 1995.
Thesis: C. Graham, The Limiting Heat Transfer Mechanism of Dropwise Condensation, Ph.D. thesis, Massachusetts Institute of Technology, Cambridge, Mass., 1969.
Report: E. Book and H. Bratman, Using Compilers to Build Compilers, Systems Development Corp. Rept. SP-176, Santa Monica, Calif., Aug. 1960.
Proceedings: S.L. Soo, Boundary Layer Motion of a Gas-Solid Suspension, Proc. Symp. Interaction between Fluids and Particles, vol. 1, pp. 50-63, 1962.
Edited Book: E.R.G. Eckert, Physical Laws of Fluid Mechanics and Their Application to Measurement Techniques, in R.J. Goldstein (ed.), Fluid Mechanics Measurements, Second Edition, chap. 2, Taylor & Francis, Washington, D.C., 1996. Always give inclusive page numbers for references to journal articles and pages or a chapter number for books. All references must be cited in the text.
Illustrations
Illustrations submitted (line drawings, halftones, photos, photomicrographs, etc.) should be clean originals or digital files. Digital files are recommended for highest quality reproduction and should follow these guidelines:
- 300 dpi or higher
- sized to fit on journal page
- EPS, TIFF, or PSD format only
- submitted as separate files, not embedded in text files
Color illustrations will be considered for publication; however, the author will be required to bear the full cost involved in their printing and publication. The charge for the first page with color is $900.00. The next three pages with color are $450.00 each. A custom quote will be provided for color art totaling more than 4 journal pages. Good-quality color prints or files should be provided in their final size. The publisher has the right to refuse publication of color prints deemed unacceptable.
Tables and Figures
Tables and figures should not be embedded in the text, but should be included as separate sheets or files. A short descriptive title should appear above each table with a clear legend and any footnotes suitably identified below. All units must be included. Figures should be completely labeled, taking into account necessary size reduction. Captions should be typed, double-spaced, on a separate sheet. All original figures should be clearly marked in pencil on the reverse side with the number, author's name, and top edge indicated.
Cover Art
Submissions for art to appear on the cover are welcomed. The art can be in black-and-white or color; however, if in color, it must be paid for by the author. This art must be part of or related to a review article or report that is published in the same issue. The editors reserve the right to choose the artwork based on technical content and aesthetic value.
Equations
Each equation should appear on a separate or new line and be carefully typewritten and checked so that a typesetter can follow the copy easily. They should be numbered in the order they are cited in the text with Arabic equation numbers placed in parentheses on the right-hand margin. They should be cited in the text as, for example, Eq. (10) or Eqs. (12)-(16).
Units
Units should be SI using prefixes in units of 103.
Offprints
Each author of the article will receive a complete copy of the issue in which the article appears, up to a total of 3 copies per article. The corresponding author is responsible for distribution of the copies to all coauthors. Offprints of an individual article may be ordered from Taylor & Francis by using the offprint order form included with the page proofs.
Founding Editor:
Professor C.L. Tien
University of California at Berkeley
Editor-in-Chief:
Arunava Majumdar
Department of Mechanical Engineering
5131 Etcheverry Hall
UC Berkeley, Berkeley, Ca 94720
Editors:
Van P. Carey (Web Page Editor) - Department of Mechanical Engineering, University of California, Berkeley, CA 94720-1740, USA
G.P. "Bud" Peterson - Office of the Provost, Rensselaer Polytechnic Institute, Troy, NY 12180, USA
Akira Yabe - Research Center for Advanced Manufacturing on Nanoscale Science and Engineering, AIST, 1-2-1, Namiki, Tsukuba Science City, Ibaraki, Japan 305-8564
Gang Chen - Massachusetts Institute of Technology, Cambridge, MA USA
Massoud Kaviany - University of Michigan, Ann Arbor, MI USA
David Cahill - University of Illinois, Urbana, IL USA
Kenneth Goodson - Stanford University, Stanford, CA USA
Pamela Norris - University of Virginia, Charlottesville, VA USA
Shigeo Maruyama - University of Tokyo, Tokyo, JAPAN
Shigeki Hirasawa - Kobe University, JAPAN
Xin-gang Liang - Tsinghua University, Beijing, CHINA
Hsin-Chen Chu - National Chiao Tung University, Hsin Chu TAIWAN
Dimos Poulikakos - Swiss Federal Institute of Technology, Zurich, SWITZERLAND
Jean-Jacques Greffet - Le'Ecole Centrale, Paris / CNRS, FRANCE
Gian Piero Celata - ENEA National Institute of Thermal-Fluid Dynamics, Rome ITALY
Thomas Thundat - Molecular Imaging Group, Oak Ridge National Laboratory, Oak Ridge, TN USA
Editorial Advisory Board:
Richard O. Buckius - University of Illinois at Urbana-Champaign, Urbana, IL, USA
Zeng-Yuan Guo - Tsinghua University, Beijing, China
Alexander Ivanovich Leontiev - Russian Academy of Sciences, Moscow, Russia
Kaigham Gabriel - Carnegie Mellon University, Pittsburgh, PA, USA
Akiro Nagashima - Keio University, Tokyo, Japan
Shigeki Hirasawa - Hitachi, Ltd., Ibaraki, Japan
Joon Sik Lee - School of Mechanical & Aerospace Engineering, Seoul National University, South Korea
Toshiro Makino - Kyoto University, Kyoto, Japan
Markus I. Flik - Behr GmbH & Company, Stuttgart, Germany
Frank P. Incropera - Purdue University, West Lafayette, IN, USA
Vishwanath Prasad - State University of New York, Stony Brook, NY, USA
刊名字顺( Alphabetical List of Journals):
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