期刊名称：APPLIED SOFT COMPUTING
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
 Applied Soft Computing is an international journal promoting an integrated view of soft computing to solve real life problems. Soft computing is a collection of methodologies, which aim to exploit tolerance for imprecision, uncertainty and partial truth to achieve tractability, robustness and low solution cost. The focus is to publish the highest quality research in application and convergence of the areas of Fuzzy Logic, Neural Networks, Evolutionary Computing, Rough Sets and other similar techniques to address real world complexities.
Applied Soft Computing is a rolling publication: articles are published as soon as the editor in chief has accepted them. Therefore, the web site will continuously be updated with new articles and the publication time will be short.
Major Topics
The scope of this journal covers the following soft computing and related techniques, interactions between several soft computing techniques, and their industrial applications:
Fuzzy Computing
Neuro Computing
Evolutionary Computing
Probabilistic Computing
Immunological Computing
Hybrid Methods
Intelligent Agents and Agent Theory:
Causal Models
Case-based Reasoning
Chaos Theory
Interactive Computational Models
The application areas of interest include but are not limited to:
Decision Support
Process and System Control
System Identification and Modelling
Optimisation
Signal or Image Processing
Vision or Pattern Recognition
Condition Monitoring
Fault Diagnosis
Systems Integration
Internet Tools
Human-Machine Interface
Time Series Prediction
Robotics
Motion Control and Power Electronics
Biomedical Engineering
Virtual Reality
Reactive Distributed AI
Telecommunications
Consumer Electronics
Industrial Electronics
Manufacturing Systems
Power and Energy
Data Mining
Data Visualisation
Intelligent Information Retrieval
Bio-inspired Systems
Autonomous Reasoning
Intelligent Agents
Instructions to Authors
Types of Paper
Authors are invited to submit technical papers (no limit on max. number of pages), state of the art survey papers, industry reports (max. 5 pages) and book reviews. Authors are encouraged to utilize the opportunity given by this on-line publication to include animations, software demonstrations, and video clips etc. The papers will be published on Elsevier Web Site as soon as they are accepted, which enables authors to publish their work FAST and readers get the latest work in Soft Computing on their desktop!
Contact Details for Submission
For any further queries and special issue proposals, please contact:
Dr. Rajkumar Roy
Editor in Chief
Decision Engineering Centre,
Cranfield University,
Cranfield, Bedford,
MK43 0AL,
United Kingdom.
Tel: +44 (0)1234 750111 Ext. 5523 Email: asoc@cranfield.ac.uk
More details please see the doc. file below
Instructions to Authors
1568-4946.doc
Editorial Board
Editor-in-Chief:
R. Roy
Professor of Decision Engineering, Cranfield University, Cranfield, Bedford, MK43 0AL, UK, Tel: +44 (0) 1234 754073, Fax: +44 (0) 1234 750852, Email: asoc@cranfield.ac.uk
Honorary Editor:
L.A. Zadeh
University of California, Berkeley Initiative in Soft Computing (BISC), CS Division, Department of EECS, Berkeley, CA 94720-1776, USA
Steering Committee:
T. Furuhashi
Nagoya University, Nagoya, Japan
D. Goldberg
University of Illinois at Urbana-Champaign, Illinois, USA
F. Hoffmann
Royal Institute of Technology, Stockholm, Sweden
S.J. Ovaska
Helsinki University of Technology, Otakaari, Finland
N.R. Pal
Indian Statistical Institute, Calcutta, India
R. Roy
Cranfield University, Bedford, UK
Y. Suzuki
Muroran Institute of Technology, Muroran, Japan
Book Review Editors:
M. Köppen
Fraunhofer IPK
A. Tiwari
Cranfield University, Bedford, UK
Editorial Board:
H. Adeli
The Ohio State University, Columbus, USA
V. Bajic
Institute for Infocomm Research (I2R), Singapore
W. Banzhaf
University of Dortmund, Dortmund, Germany
A. Bulsari
Nonlinear Solutions OY, Turku, Finland
D.W. Corne
University of Reading, Reading, UK
D. Davis
NUTECH Solutions, Inc. Newbury, USA
K. Deb
Indian Institute of Technology, Kampur, India
B. DeBaets
Ghent University, Belgium
I. De Falco
National Research Council of Italy (CNR), Naples, Italy
T.S. Dillon
Bundoora Campus, Australia
A.E. Eiben
Free University Amsterdam, Amsterdam, The Netherlands
M.J. Embrechts
Rensselaer Polytechnic Institute, Troy, NY, USA
T.C. Fogarty
South Bank University, London, UK
T. Fukuda
Nagoya University, Nagoay, Japan
X.-Z. Gao
Helsinki University of Technology, Otakaari, Finland
E.D. Goodman
Michigan State University, East Lansing, MI USA
Y. Hata
Himeji Institute of Technology, Himeji, Japan
H. Hautop-Lund
Odense University, Denmark
L.C. Jain
University of South Australia, Adelaide, Australia
A. Kamiya
Kushiro National College of Technology, Kushiro, Japan
N. Kasabov
Auckland University, New Zealand
O. Kaynak
Bogazici University, Istanbul, Turkey
P. Lisboa
Liverpool John Moores University, Liverpool, UK
L.J. Mazlack
University of Cincinnati, Ohio, USA
W. Pedrycz
University of Alberta, Edmonton, Canada
M. Schoenauer
INRIA, Rocquencourt, France
C. Sun
Haidian University, Beijing, China
B. Turksen
University of Toronto, Canada
K. Ueda
University of Tokyo, Japan
D.C. Wunsch
University of Missouri-Rolla, Rolla, MO, USA
B.T. Zhang
Seoul National University, Seoul, Korea
H.-J. Zimmermann
INFORM GmbH, Aachen, Germany
Industrial Panel:
B. Azvine
BtexaCT, Ipswich, UK
E.B. Baum
NEC Research Institute, Princeton, USA
M. Herdy
INPRO GmbH, Berlin, Germany
T. Iokibe
Research Institute of Application Technologies for Chaos & Complex Systems, Yokohama, Japan
M. Olhofer
Honda R&D Europe (Deutschland) GmbH, Offenbach, Germany
S. Patel
Port Sunlight Laboratory, Wirral, UK
A. Satyadas
IBM Corporation, Cambridge, MA, USA
A. Wright
Advanced Technology Centre Sowerby, Bristol, UK
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