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期刊名称：ENGINEERING WITH COMPUTERS ISSN： 0177-0667 出版频率： Quarterly 出版社： SPRINGER, ONE NEW YORK PLAZA, SUITE 4600 , NEW YORK, United States, NY, 10004   出版社网址： http://www.springer.com/?SGWID=8-102-0-0-0 期刊网址： http://www.springer.com/computer/information+systems+and+applications/journal/366 影响因子： 7.963 主题范畴： COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS;    ENGINEERING, MECHANICAL 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal   Engineering with Computers An International Journal for Simulation-Based Engineering Editor: M. Shephard ISSN: 0177-0667 (print version) ISSN: 1435-5663 (electronic version) Journal no. 366 Springer London Online version available Online First articles available Engineering with Computers is an international journal for simulation-based engineering. It publishes original papers and authoritative state-of-the-art reviews on the technologies supporting simulation-based engineering, and examples of operational simulation-based engineering systems. A partial list of the technical areas covered includes: adaptive simulation techniques, engineering databases, integration with CAD geometry, mesh generation, parallel simulation methods, simulation frameworks, user interface technologies and visualization techniques. Application areas covered include any to which engineering technologies are applied and will range from applications in the automotive industry, to the design of medical devices. Instructions to Authors   How to submit your manuscript Please prepare your manuscript following the detailed Instructions for Authors for this journal. They can be accessed from the For Authors and Editors Link Section in the frame on the right hand side of this page. Online submission via email For initial submission manuscripts should preferably be submitted via e-mail in the form of a pdf-file or in standard word processing format (e.g. Word) including all figures and tables. Please click on “Submit online?in the For Authors and Editors Link Section on the right hand side of this page. Please submit the following information: Name of the corresponding author E-mail address Full postal address Telephone and fax numbers Title of the manuscript Desired section or sub field as appropriate and attach your file(s). If the total size of your files exceeds 10MB, please only provide the information specified above and send a CD-ROM with your manuscript by post. Hardcopy submission If you are unable to submit your manuscript online please send your manuscript to the responsible editor. Mailing addresses of the Editors can be found on the Editorial Board page or in the Instructions for Authors for this journal. Instructions to Authors E0177-0667.pdf Editorial Board   Springer-Verlag London Ltd Ashbourne House, The Guildway Old Portsmouth Road Guildford, Surrey, GU3 1LP UK Tel: +44 (0) 1483 734437 Fax: +44 (0) 1483 734411 journals@svl.co.uk EDITOR: Prof. Mark S. Shephard Director Scientific Computation Research Center, Rensselaer Polytechnic Institute, Troy, New York 12180-3590, USA Tel: (518) 276-6795 Fax: (518) 276-4886 Email: shephard@scorec.rpi.edu FOUNDING EDITORS: Professor Ted Belytschko and Professor Steven J. Fenves EDITORIAL BOARD Klaus J. Bathe Massachusetts Institute of Technology, Cambridge, Massachusetts, USA Ted D. Blacker Sandia National Laboratories, Albuquerque, New Mexico, USA Graham F. Carey The University of Texas at Austin, Austin, Texas, USA Robert H. Dodds University of Illinois, Urbana, Illinois, USA Charbel Farhat University of Colorado at Boulder, Boulder, Colorado, USA Peter M. Finnigan General Electric Corporate Research & Development, Schenectady, New York, USA E. J. Haug University of Iowa, Iowa City, Iowa, USA Thomas J. R. Hughes Stanford University, Stanford, California, USA Anthony R. Ingraffea Cornell University, Ithaca, New York, USA Norboru Kikuchi The University of Michigan, Ann Arbor, Michigan, USA Uri Kirsch Technion-Israel Institute of Technology, Technion City, Haifa, Israel Louis Komzsik EDS-UGS, Cypress, CA, USA Kincho H. Law Stanford University, Stanford, San Francisco, USA R. W. Lewis University of Wales, Swansea, UK Ahmed K. Noor ODU-NASA Langley Research Center, Hampton, Virginia, USA Peter J. Pahl Technische Universität Berlin, Germany Kenneth Preiss Ben Gurion University of the Negev, Beer Sheva, Israel Ekkehard Ramm University of Stuttgart, Stuttgart, Germany Sunil Saigal Carnegie Mellon University, Pittsburgh, Pennsylvania, USA Ian F. C. Smith EPFL - Swiss Federal Institute of Technology, Lausanne, Switzerland Barna A. Szabo Washington University, St Louis, Missouri, USA Nigel P. Weatherill University of Wales, Swansea, UK Nils-Erik Wiberg Chalmers University of Technology, Gothenburg, Sweden Peter Wriggers TU Darmstadt, Darmstadt, Germany Thomas Zimmermann LSC-DGC, EPFL, Lausanne, Switzerland