期刊名称：ADVANCED ENGINEERING INFORMATICS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
Many important characteristics of advanced computing applications are changing the way engineers interact with computers. Explicit knowledge representation formalisms and advanced reasoning techniques are no longer the sole territory of artificial intelligence (AI). New approaches have earned acceptance in many research communities and several proposals have emerged in commercial software. In general, researchers and commercial developers now employ a range of advanced computing techniques including, but not limited to, those originating from AI research. Although some techniques are still useful for automating mundane tasks, many are capable of enhancing the working environment and empowering engineers in ways that have not previously been possible. In all areas that involve knowledge-intensive tasks, a new philosophy that is specifically tailored to computer applications in engineering is revolutionising the field: an "engineering informatics" is emerging.
Advanced Engineering Informatics is an international journal that provides a forum for the exchange of topical research into supporting knowledge-intensive engineering tasks from initial conception to product disposal or demolition. The Journal publishes papers featuring novel computer applications that evaluate benefits, possibilities and risks of engineering informatics. Such applications typically include one or more of the following features:
* Explicit representations, describing physical and abstract components, their attributes and relationships in ways that enable shared reasoning support and incremental improvement;
* Symbolic and numerical process models, allowing collaborative reasoning about the conception, design, construction, control and operational behaviour of engineering artefacts;
* Graphical user interfaces, presenting different visualisations, including 3D views and animations of physical objects as well as other representations such as special symbols for engineering diagrams, formulas, graphs, network schemas and tables;
* Large-scale databases, including perhaps millions of related, shared, reusable and potentially changing elements;
* Interactivity, enabling individual and distributed users to carry out activities such as: interpreting intermediate solution stages; changing product and process model characteristics while examining the consequences; introducing new contextual information even at intermediate stages; modifying solution strategies on the fly; taking cues from active support; and exploring solution spaces in order to help evaluate criteria that are difficult to model explicitly.
The scope of the Journal covers all activities associated with advanced engineering informatics. Thus, in addition to the technical issues described above, the Journal welcomes papers addressing the challenges of implementing and maintaining such systems in the work place, thereby enabling professionals to do their work more creatively, effectively, systematically and accurately than they do in current practice.
Advanced Engineering Informatics publishes full research papers, case studies, reviews of key topics, benchmark test results and technical notes that report on features such as those described above. Although descriptions of specific applications are welcome, they should be employed to draw more general conclusions related to the use of representations, reasoning methods and development methodologies. Furthermore, system evaluations, performance comparisons, user testing and other attempts to measure and compare utility are specifically encouraged.
Instructions to Authors
SUBMISSION OF PAPERS
Authors are requested to submit their original manuscript and figures with two copies to one of the Editors:
Dr J.C. Kunz, Stanford University, Center for Integrated Facility Engineering, Building 550, Stanford, CA 94305-4020, USA; E-mail: kunz@ce.stanford.edu
Professor I.F.C. Smith, IMAC-ISS, DGC (Ecublens), EPFL, 1015 Lausanne, Switzerland; E-mail: ian.smith@epfl.ch
Professor T. Tomiyama, Faculty of Design, Engineering and Production, Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands; E-mail: t.tomiyama@wbmt.tudelft.nl
All papers should be written in English. Papers of an advertising nature will not be accepted.
Submission of a paper implies that it has not been published previously, that it is not under consideration for publication elsewhere, and that if accepted it will not be published elsewhere in the same form, in English or in any other language, without the written consent of the publisher. All papers should be written in English.
TYPES OF CONTRIBUTIONS
Original papers, review articles, short communications/technical notes; reports of conferences and meetings; book reviews; letters to the editors, forthcoming meetings.
MANUSCRIPT PREPARATION
General: Manuscripts must be typewritten, double-spaced with wide margins on one side of white paper. Good quality printouts with a font size of 12 or 10 pt are required. The corresponding author should be identified (include a fax number and e-mail address). Full postal addresses must be given for all co-authors. Authors should consult a recent issue of the journal for style if possible. An electronic copy of the paper should accompany the final version. The Editors reserve the right to adjust style to certain standards of uniformity. Authors should retain a copy of their manuscript since we cannot accept responsibility for damage or loss of papers. Original manuscripts are discarded one month after publication unless the Publisher is asked to return original material after use.
Abstracts: Each paper should be provided with an Abstract of about 100-150 words, reporting concisely on the purpose and results of the paper. Abstracts should include not more than 10 key words which reflect the entires the authors would like to see in an index.
Text: Follow this order when typing manuscripts: Title, Authors, Affiliations, Abstract, Keywords, Main text, Acknowledgements, Appendix, References, Vitae, Figure Captions and then Tables. Do not import the Figures or Tables into your text. The corresponding author should be identified with an asterisk and footnote. All other footnotes (except for table footnotes) should be avoided.
Units: The SI system should be used for all scientific and laboratory data; if, in certain instances, it is necessary to quote other units, these should be added in parentheses. Temperatures should be given in degrees Celsius. The unit 'billion' (109 in America, 1012 in Europe) is ambiguous and must not be used.
Symbols: Abbreviations for units should follow the suggestions for the British Standards publication BS 1991. The full stop should not be included in abbreviations, e.g. m (not m.). ppm (not p.p.m.), '%' and '/' should be used in preference to 'per cent' and 'per'. Where abbreviations are likely to cause ambiguity or not be readily understood by an international readership, units should be put in full.
References: All publications cited in the text should be presented in a list of references following the text of the manuscript. In the text refer to references by a number in square brackets on the line (e.g. Since Wen [1]), and the full reference should be given in a numerical list at the end of the paper.
References should be given in the following form:
1. Wen F, Chang CS. A new method for diagnostic problem solving based on a fuzzy abductive inference model and the tab. search approach. Artificial Intell Engin 1999;13(1):83-90.
2. Quine WVO. Word and object. Cambridge, Mass: MIT Press, 1960.
3. Oxman R, Gero JS. Designing prototype refinement in architecture. In: Gero JS, editor. Artificial intelligence in engineering design. New York: Elsevier, 1988. p. 395-412.
4. Jones J, Milligton M. An Edinburgh prolog blackboard shell, DAI Research Paper No. 281. Edinburgh University, 1986.
Illustrations: All illustrations should be provided in camera-ready form, suitable for reproduction (which may include reduction) without retouching. Photographs, charts and diagrams are all to be referred to as "Figure(s)" and should be numbered consecutively in the order to which they are referred. They should accompany the manuscript, but should not be included within the text. All illustrations should be clearly marked on the back with the figure number and the author's name. All figures are to have a caption. Captions should be supplied on a separate sheet.
Line drawings: Good quality printouts on white paper produced in black ink are required. All lettering, graph lines and points on graphs should be sufficiently large and bold to permit reproduction when the diagram has been reduced to a size suitable for inclusion in the journal. Dye-line prints or photocopies are not suitable for reproduction. Do not use any type of shading on computer-generated illustrations.
Photographs: Original photographs must be supplied as they are to be reproduced (e.g. black and white or colour). If necessary, a scale should be marked on the photograph. Please note that photocopies of photographs are not acceptable.
Colour: Where colour figures are required the author will be charged at the current colour printing costs.
Tables: Tables should be numbered consecutively and given a suitable caption and each table typed on a separate sheet. Footnotes to tables should be typed below the table and should be referred to by superscript lowercase letters. No vertical rules should be used. Tables should not duplicate results presented elsewhere in the manuscript, (e.g. in graphs).
ELECTRONIC SUBMISSION
Authors should submit an electronic copy of their paper with the final version of the manuscript. The electronic copy should match the hardcopy exactly. Always keep a backup copy of the electronic file for reference and safety. Full details of electronic submission and formats can be obtained from http://authors.elsevier.com or from Author Services at Elsevier Science.
PROOFS
Proofs will be sent to the author (first named author if no corresponding author is identified of multi-authored papers) and should be returned within 48 hours of receipt. Corrections should be restricted to typesetting errors; any others may be charged to the author. Any queries should be answered in full. Please note that authors are urged to check their proofs carefully before return, since the inclusion of late corrections cannot be guaranteed. Proofs are to be returned to the Log-in Department, Elsevier Science, The Boulevard, Langford Lane, Kidlington, Oxford OX5 1GB, UK.
OFFPRINTS
Twenty-five offprints and one copy of the issue will be supplied free of charge. Additional offprints and copies of the issue can be ordered at a specially reduced rate using the order form sent to the corresponding author after the manuscript has been accepted. Orders for reprints (produced after publication of an article) will incur a 50% surcharge.
COPYRIGHT
All authors must sign the "Transfer of Copyright" agreement before the article can be published. This transfer agreement enables Elsevier Science Ltd to protect the copyrighted material for the authors, without the author relinquishing his/her proprietary rights. The copyright transfer covers the exclusive rights to reproduce and distribute the article, including reprints, photographic reproductions, microfilm or any other reproductions of a similar nature, and translations. It also includes the right to adapt the article for use in conjunction with computer systems and programs, including reproduction or publication in machine-readable form and incorporation in retrieval systems. Authors are responsible for obtaining from the copyright holder permission to reproduce any material for which copyright already exists.
AUTHOR ENQUIRIES
For enquiries relating to the submission of articles (including electronic submission), the status of accepted manuscripts, author Frequently Asked Questions and any other enquiries relating to Elsevier Science, please consult Elsevier's Author Gateway.
Contact details for questions arising after acceptance of an article, especially those relating to proofs, are provided when an article is accepted for publication.
Editorial Board
-
- Editors:
- J.C. Kunz, Stanford University, Center for Integrated Facility Engineering, Building 550, Stanford, CA 94305-4020, USA Tel: +1 415 725 1546, Fax: +1 415 723 4806, Email: kunz@stanford.edu
I.F.C. Smith, Applied Computing and Mechanics (IMAC), Swiss Federal Institute of Technology (EPFL), CH-1015 Lausanne, Switzerland Email: Ian.Smith@epfl.ch
T. Tomiyama, Faculty of OCP, Delft University of Technology, 2628 CD Delft, Netherlands Tel: +31 15 278 1021, Email: t.tomiyama@wbmt.tudelft.nl
- Editorial Board:
- B. Akinci, Carnegie Mellon University, Pittsburgh, PA, USA
C. Anumba, Loughborough University, UK
R. Banares-Alcantara, Universitat Rovira i Virgili, Tarragona, Spain
J.-P. Barthes, Universite de Technologie de Compiegne, France
J. Bento, Instituto Superior Tecnico, Lisboa, Portugal
L. Blessing, Technical University of Berlin, Germany
J. Bowen, University College Cork, Ireland
B. Chandrasekaran, Ohio State University, Columbus, OH, USA
M.J. Clayton, Texas A+M University, College Station, TX, USA
J. Garrett Jr, Carnegie Mellon University, Pittsburgh, PA, USA
J.S. Gero, University of Sydney, Australia
D.E. Grierson, University of Waterloo, Canada
S. Imamura, Ministry of International Trade and Industry, Tsukuba Ibaraki, Japan
Y. Jin, University of Southern California, Los Angeles, CA, USA
L. Joskowicz, Hebrew University of Jerusalem, Israel
B. Kumar, Glasgow Caledonian University, Glasgow, UK
M.H. Lee, University of Wales, Aberystwyth, UK
A. Markus, Hungarian Academy of Sciences, Budapest, Hungary
R. Milne, Intelligent Applications Ltd, Livingston, West Lothian, UK
R. Mizoguchi, Osaka University, Japan
C.J. Moore, Cardiff University, UK
H. Motoda, Osaka University, Japan
A. Nigam, IBM TJ Watson Research Center, Yorktown Heights, NY, USA
T. Nishida, The University of Tokyo, Japan
D.T. Pham, University of Wales, Cardiff, UK
K. Preiss, Ben Gurion University of the Negev, Beer Sheva, Israel
B. Raphael, Swiss Federal Institute of Technology, Lausanne, Switzerland
Y. Reich, Tel Aviv University, Ramat Aviv, Israel
K. Shea, University of Cambridge, UK
T. Smithers, VICOM Tech, Donostia/San Sebastian, Spain and Mondragon Unibertsitatea, Oñati, Spain
K. Ueda, University of Tokyo, Japan
T. Washio, Osaka University, Japan
P.M. Wognum, University of Twente, Enschede, Netherlands
D. Xue, University of Calgary, Canada
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