期刊名称：APPLIED MATERIALS TODAY ISSN： 2352-9407 出版频率： Quarterly 出版社： ELSEVIER, RADARWEG 29, AMSTERDAM, NETHERLANDS, 1043 NX   出版社网址： https://www.elsevier.com/zh-cn 期刊网址： https://www.journals.elsevier.com/applied-materials-today 影响因子： 10.041 主题范畴： MATERIALS SCIENCE, MULTIDISCIPLINARY 变更情况： 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal Applied Materials Today is a multi-disciplinary, rapid-publication journal focused on cutting edge applications of novel materials. New materials discoveries have led to exciting fundamental breakthroughs. Materials research is now moving towards the translation of these scientific properties and principles to applied technologies. Applied Materials Todaycovers all aspects of materials application, spanning chemistry, physics, engineering, and biology: publishing high impact articles on novel electronic, optical, mechanical, and energy devices, as well as medicine, the environment and the impact on society. Part of the Materials Today family, Applied Materials Today offers authors rigorous peer review, rapid decisions, and high visibility. The editors welcome comprehensive articles, short communications and reviews on topics including but not limited to: Two dimensional materials Wearable electronics 3D printing/Additive manufacturing Materials for energy Functional materials Materials synthesis Nanomaterials and nanotechnology Biomaterials and nanomedicine Ramifications on society Health and environmental impact Research commercialization Fundamental principles with a view to specific applications Abstracting and Indexing Emerging Sources Citation Index (ESCI) Scopus Instructions to Authors  Author information pack • Types of article • Submission checklist BEFORE YOU BEGIN • Ethics in publishing • Declaration of interest • Submission declaration and verification • Use of inclusive language • Changes to authorship • Copyright • Role of the funding source • Open access • Submission PREPARATION • Peer review • Article structure • Essential title page information • Highlights • Abstract • Keywords • Artwork • Tables • References • Video • Supplementary material • RESEARCH DATA AFTER ACCEPTANCE • Online proof correction • Offprints AUTHOR INQUIRIES Instructions to Authors 736582.pdf Editorial Board Editor-in-Chief M. Pumera University of Chemistry and Technology, Prague, Czech RepublicEmail M. Pumera Associate Editor M Daturi ENSICAEN - CNRS University of Caen, Caen, France C. Wu Chinese Academy of Sciences (CAS), Shanghai, China Editorial Board Members K. Ariga National Institute for Materials Science (NIMS), Tsukuba, Japan Z. Bao Stanford University, Stanford, California, USA T. Bender University of Toronto, Toronto, Ontario, Canada X. Cao University of Science and Technology Beijing, Beijing, China H.M. Cheng Chinese Academy of Sciences (CAS), Shenyang, China N. Cho Nanyang Technological University, Singapore, Singapore S. Cohen University of California at San Diego (UCSD), La Jolla, California, USA S. Eigler Chalmers University of Technology, Gothenburg, Sweden A. Escarpa Universidad de Alcalá, Alcalá de Henares, Spain A.F. Facchetti Northwestern University, Evanston, Illinois, USA L. Gang Ningbo Institute of Materials Technology and Engineering, Zhejiang, China J. Guan Wuhan University of Technology, Wuhan, China A. Hirsch Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany J.X. Huang Northwestern University, Evanston, Illinois, USA H. Imahori Kyoto University, Kyoto, Japan K. Kalantar-zadeh UNSW Australia, Sydney, New South Wales, Australia L. Kian Ping National University of Singapore, Kent Ridge, Singapore K. Kostarelos University of Manchester, Manchester, England, UK C. S. Lee City University of Hong Kong, Kowloon, Hong Kong Y.H. Lee Sungkyunkwan University (SKKU), Suwon, The Republic of Korea X.-Y. Ling Nanyang Technological University, Singapore, Singapore J. Liu University of Surrey, Guildford, Surrey, UK J. Lou Rice University, Houston, Texas, USA H. Luo New Mexico State University, Las Cruces L. Mai Wuhan University of Technology, Wuhan, China J. Mano Universidade de Aveiro, Aveiro, Portugal A. D. Mohite Los Alamos National Laboratory, Los Alamos, New Mexico, USA P. Neuzil Northwestern Polytechnical University, Xi'an, China S. Pané i Vidal ETH Zürich, Zurich, Switzerland H. Peng Peking University, Beijing, China Z. Ren University of Houston, Houston, Texas, USA J.A. Rogers University of Illinois at Urbana-Champaign, Urbana, Illinois, USA E. Saiz Gutierrez Imperial College London, London, England, UK M. Terrones Pennsylvania State University, University Park, Pennsylvania, USA H. Wang China University of Mining and Technology, Xuzhou, China J. Wang University of California at San Diego (UCSD), La Jolla, San Diego, California, USA J. Warner University of Oxford, Oxford, UK A.S. Weiss The University of Sydney, Sydney, New South Wales, Australia J. Yuan Stockholms Universitet, Stockholm, Sweden G. Yushin Georgia Institute of Technology, Atlanta, Georgia, USA R. Zboril Palacky University, Olomouc, Czech Republic H. Zhang Nanyang Technological University, Singapore, Singapore X. Zhang Wuhan University, China Z. Zhang Zhejiang University, Hangzhou, China