期刊名称：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Title History
Subjects
- Aerospace
- Bioengineering
- Communication, Networking & Broadcasting
- Components, Circuits, Devices & Systems
- Computing & Processing (Hardware/Software)
- Engineered Materials, Dielectrics & Plasmas
- Engineering Profession
- Fields, Waves & Electromagnetics
- General Topics for Engineers (Math, Science & Engineering)
- Geoscience
- Nuclear Engineering
- Photonics & Electro-Optics
- Power, Energy, & Industry Applications
- Robotics & Control Systems
- Signal Processing & Analysis
- Transportation
Instructions to Authors
stylemanual.pdf
Editorial Board
Co-Editor
Jose E Schutt-Aíne
Electrical Performance of Integrated Systems
University of Illinois at Urban Champaign
Electrical and Computer Engineering
155 Everitt Laboratory, 1406 W. Green St.
Urbana, IL 61801 USA
jschutt@emlab.uiuc.edu
Phone:+1 217 244 7279
Co-Editor
Koneru Ramakrishna
Components: Characterization and Modeling
Austin, TX 78735 USA
rama@ieee.org
Co-Editor
Kuo-Ning Chiang
Packaging Technologies
National Tsing Hua University
Department of Power Mechanical Engineering
No.101, Sec.2, Kuang Fu Road
Hsinchu 300 Taiwan
knchiang@pme.nthu.edu.tw
Phone:886 3 5742925
Co-Editor
R. Wayne Johnson
Electronics Manufacturing
Laboratory for Electronics Packaging and Assembly Electrical and Computer Engineering
Auburn University
162 Broun Hall
Auburn, AL 36849-5201 USA
johnson@eng.auburn.edu
Phone:+ 1 334 844 1880
Co-Editor
Ravi Mahajan
Advanced Packaging
Intel
Pathfinding
5000 W. Chandler Blvd.
Chandler, AZ 85226 USA
ravi.v.mahajan@intel.com
Phone:+1 480 554 3715
Managing Editor
R. Wayne Johnson
Laboratory for Electronics Packaging and Assembly Electrical and Computer Engineering
Auburn University
162 Broun Hall
Auburn, AL 36849-5201 USA
johnson@eng.auburn.edu
Phone:+1 334 844 1880
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