期刊名称：KSII TRANSACTIONS ON INTERNET AND INFORMATION SYSTEMS ISSN： 1976-7277 出版频率： Bi-monthly 出版社： KSII-KOR SOC INTERNET INFORMATION, KOR SCI & TECHNOL CTR, 409 ON 4TH FLR, MAIN BLDG, 635-4 YEOKSAM 1-DONG, GANGNAM-GU, SOUTH KOREA, SEOUL, 00000   出版社网址： http://www.eksii.org/ 期刊网址： http://www.eksii.org/ 影响因子： 0.858 主题范畴： COMPUTER SCIENCE, INFORMATION SYSTEMS;    TELECOMMUNICATIONS 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal The KSII Transactions on Internet and Information Systems (TIIS) is online scholarly journal indexed in SCIE (Thomson Reuters) and SCOPUS (Elsevier) and published by KSII and supported by KETI. The Transactions is published every other month. The Transactions is designed to allow readers to obtain the most state of the art in a number of focusing areas related to wired & wireless internet and information systems. The technologies and applications of IT are very rapidly changing and updating. Thus quick publication and distribution to researchers, developers, deployment engineers, technical managers, and educators are crucial. Our most important aim is to publish the accepted papers quickly after receiving the manuscript. The Transactions consists of regular and special issue papers. The papers are strictly peer-reviewed. Both theoretical and practical contributions are encouraged.   The scope of interests of the Transactions includes, but is not limited to, the following:             [Internet]             • Wireless sensor networks/wireless mesh networks             • Smartphone applications and services             • Ubiquitous/pervasive computing/WBAN (wireless body area networks)             • Internet contents             • Mobile/vehicular ad-hoc network communications             • LTE/WiMax and MIMO/OFDM             • Cognitive radio and cooporative communications             • Energy-efficient communications and green computing             • Smart grid computing and distributed computing Instructions to Authors Submitting Original Papers and Plagiarism Policy   All authors are supposed to submit the manuscript containing original contents. The manuscript which has not been simultaneously submitted to, nor published in any other publication channels, solely can be accepted. If the same paper is found appearing or published in any other publication, the paper will be automatically rejected. The paper previously published in other minor publications such as conference, workshop, seminar, or proceedings can be eligible for being reviewed and published in the Transactions. But we require that the paper be substantially revised with at least 30% new contents which have never been published in the previous publications. Even though the new results from the conference paper are not required, the revised manuscript version should include expansion of key ideas, examples, explanations, figures, tables, elaborations, etc. The manuscript should indicate its previously published conference name and date as a footnote in the left bottom of the first page. Authors very briefly indicate how the new submission offers substantial novel contributions beyond those of the previously published paper(s) or proceedings. We strictly prohibit plagiarism and self plagiarism. If plagiarism is found in a paper in review or in the publication, the Steering Committee of the TIIS journal will immediately investigate the case. The severe penalty will be imposed on the author(s) related to the plagiarism case based on the investigation.   ■  Manuscript Format   The manuscript format guidelines are the following: Items Guidelines Pages More than 11 pages within 19 pages including figures, tables, and pictures. Page size 20.5cm (width) X 27.3cm (height) Column and line space Single column page and single-line space. Main context font size and style 11 point size. Times New Roman only. Main title and section title font size 18 point size, Tahoma font style, and purple color for main title. 12 point size Arial font style, purple color, and bold strokes for section title. Abstract 100~200 words.The abstract title is Arial font type and italic style in the center line. Abstract must illustrate the nature, importance, and contributions of the paper. Do not include complex symbols, mathematical notations or bibliographic references. Author name and affiliation. Author name is 10 point size. Author’s name is followed by 'Member' or ' Non-member' of KSII in italic style. Author’s affiliation should include e-mail ID and be written in 9 point size following the authors' name. You must indicate which author is the correspondent after the authors' affilliation. Keywords Provide the 5~6 keywords that best describe the contents and address the key issues of your paper. The keyword title is Arial font type and italic style. The given keywords are essential to find the appropriate reviewers. Author’s brief autobiography Author’s background should be presented in the end of the submitted paper. If the paper is accepted, author’s photo in JPG or GIF format will be requested later. References All references are numbered in order of appearing in the context of the paper. The reference number in the main contenxt is in red color. Figures and Tables The title of a figure is placed in the bottom of the figure while the one of a table in the top of the table. The font size of the title is 10 point. All figures and tables are numbered in order of appearing in the context. Figrures and Tables are in blue color both in the main context. and in the title. Colors Authors are strongly encouraged to use colors in figures, tables, and photos to enhance legibility and clearness. The manuscript must be written in MS Word and uploaded in MS Word. The manuscript submission system will convert it automatically in PDF and HTML, respectively. You can download the MS Word template as follows:             • MS Word template :DOWNLOAD                      • ICONI 2010 Full Paper Template (For Conference Only) : DOWNLOAD ■  Review Process Authors can send the manuscript only by electronically uploading it via the Manuscript Submission in the main menu. The sent paper will be reviewed by two or more independent referees who have professional backgrounds in the pertinent subject area.   Authors are only given one time revision. There is no more than one time revision except for a special case which the editorial board members consider a paper to be extraordinarily high quality or interesting to the readers. The authors should adhere strictly to the revision deadline. Unless the revised manuscript does meet the requirements of the referees and editors, it will be rejected without further process. The sent paper will be given ‘accept’, ‘reject’, or ‘revision’: Decision Description Accept An accept decision means that an editor is accepting the paper with no further modifications. The paper will not be seen again by the editor or by the reviewers. Reject The manuscript is not suitable for the TIIS publication. Revision The paper is conditionally accepted with some requirements. A revision means that the paper should go back to the original reviewers for a second round of reviews. We strongly discourage editors from making a decision based on their own review of the manuscript if a revision had been previously required.  You can see your paper process status in the Paper Review Status in the main menu.   ■  Requesting for Correcting the File (After Submission) If you have made an error in submitting your manuscript (e.g., uploaded the wrong file, left one or more files out, etc.), please e-mail the TIIS assistant to notify us and make corrections.   ■  Submitting Final Publication Materials If the sent paper is accepted for publication after review process, we will send you a detailed guide and an author checklist for final paper submission requirements. Please be advised to pay close attention to the detailed requirements. You are supposed to send the final manuscript along with author’s photos and signed copyright transfer form. You can download the copyright transfer form below:   Copyright transfer form: DOWNLOAD Without receiving the signed form, we don't publish your paper. It is your responsibility to meet the due date indicated on the acceptance notice for paper publication. Please try to avoid any delay for publication by carefully going through the author checklist. For more detailed information on submitting your final publication materials, you can contact the office of the TIIS assistant.   ■  Policy on Research Publication Misconduct: Code Download   Editorial Board Editors-in-Chief Founding Editor-in-Chief : Minho Jo Korea Univ., South Korea minhojo@korea.ac.kr minhojo@gmail.com                                    Hsiao-Hwa Chen National Cheng Kung Univ., Taiwan, ROC. hshwchen@gmail.com     ●  Advisory Editorial Board Nitin  Vaidya Univ. of Illinois, Urbana-Champaign, USA nhv@uiuc.edu                                                                  Mohsen Guizani Western Michigan University, Kalamazoo, MI, USA mguizani@cs.wmich.edu                                                                                        Byungwook  Lee Kyungwon Univ., South Korea leebw@kyungwon.ac.kr                                                    Yunsik  Lee KETI, South Korea leeys@keti.re.kr   Clarence  A.  Ellis Univ. of Colorado at Boulder, USA skip@colorado.edu                                                           ●  Editors Imran  Ahmad Univ. of  Windsor, Canada imran@cs.uwindsor.ca                                                      Hitoshi Aida Univ. of  Tokyo, Japan aida@k.u-tokyo.ac.jp     Jinsuk Baek Winston-Salem State University, NC, USA baekj@wssu.edu                                                              Saad  Biaz Auburn Univ., AL, USA biazsaa@auburn.edu     Matt Bishop Univ. of  California, Davis, USA bishop@cs.ucdavis.edu                                                     Jiannong  Cao Hong Kong Polytechnic University, Hong Kong csjcao@comp.polyu.edu.hk     Chin-Chen  Chang Feng Chia University, Taiwan alan3c@gmail.com                                                           Hui  Chen Virginia State University, Petersburg, VA, USA huichen@ieee.org     Min Chen Seoul National University,South Korea ubcminchen@gmail.com                                                   Min-Hyung  Choi University of Colorado at Denver, USA min.choi@cudenver.edu   Hyunseung  Choo Sungkyunkwan Univ., South Korea choo@ece.skku.ac.kr                                                        Junchul  Chun Kyonggi Univ., South Korea jcchun@kyonggi.ac.kr   Jen-Wen  Ding National Kaohsiung University of Applied Sciences, Taiwan iwding@cc.kuas.edu.tw                                                     Xiaohu  Ge Huazhong University of Science and Technology, China xhge@mail.hust.edu.cn   Myung-Mook  Han Kyungwon Univ., South Korea mmhan@kyungwon.ac.kr                                                  Jianhua  He Swansea University, Swansea, UK j.he@swansea.ac.uk   Min  Hong Soon Chun Hyang Univ., South Korea mhong@sch.ac.kr                                                             Seng-Phil  Hong Sung Shin Woman’s Univ., South Korea philhong@sungshin.ac.kr   Zujun  Hou Institute for Infocomm Research, Singapore zhou@i2r.a-star.edu.sg                                                       Honglin  Hu Shanghai Research Center for Wireless Communications (SHRCWC), Shanghai, China hlhu@ieee.org   Jiankun Hu RMIT University, Melbourne, Australia jiankun@cs.rmit.edu.au                                                      Jiwu  Huang Sun Yat-Sen University, China isshiw@mail.sysu.edu.cn   Eui Nam  Huh Kyung Hee Univ., South Korea johnhuh@khu.ac.kr                                                           Eenjun Hwang Korea University, South Korea hwang04@korea.ac.kr   Tao  Jiang Huazhong University of Science and Technology, Hubei, China Tao.Jiang@ieee.org                                                           Min-Gu  Kang Hanshin Univ., South Korea kangmg@hs.ac.kr   Beomjin  Kim Purdue Univ. at Fort Wayne, IN, USA kimb@ipfw.edu                                                                 Dongsoo  Stephen  Kim Purdue Univ. at Indianapolis, IN, USA dskim@iupui.edu   HyoungDo  Kim Hanyang Cyber Univ., South Korea hdkim@hycu.ac.kr                                                            Jaehyoun  Kim Sungkyunkwan Univ., South Korea jhkim@comedu.skku.ac.kr Moonseong Kim Korean Intellectual Property Office, South Korea moonseong@kipo.go.kr                                                     Richard  Lai La Trobe Univ., Australia R.Lai@latrobe.edu.au   Chin-Feng  Lai Chia Nan University of Pharmacy & Science, Taiwan cinfon@ieee.com                                                              Dong Hoon Lee Korea Univ., South Korea donghlee@korea.ac.kr   Cheng  Li Memorial University of Newfoundland, NL, Canada licheng@ieee.org                                                               Zhu  Li Hong Kong Polytechnic University, Hong Kong zhu.li@ieee.org   Ying-Chang  Liang Institute for Infocomm Research, Singapore ycliang@i2r.a-star.edu.sg                                                   Xiaodong  Lin University of Ontario Institute of Technology, Canada Xiaodong.Lin@uoit.ca   Bong Gyou Lee Yonsei University., South Korea bglee@yonsei.ac.kr                                                           Chang-Gyoon  Lim Chonnam National Univ., South Korea cglim@chonnam.ac.kr   Jiangchuan  Liu Simon Fraser University, BC, Canada jcliu@cs.sfu.ca                                                                 Javier  Lopez University of Malaga, Malaga, Spain jlm@lcc.uma.es   Jaime Lloret  Mauri Polytechnic University of Valencia, Spain illoret@dcom.upv.es                                                          Tommaso  Melodia State University of New York at Buffalo, USA tmelodia@eng.buffalo.edu   Tommi  Mikkonen Tempere Univ. of Technology, Finland C.Mitchell@rhul.ac.uk                                                       Geyong  Min University of Bradford, UK g.min@brad.ac.uk   Maggie Wang Minhong The University of Hong Kong, Hong Kong      magwang@hkucc.hku.hk                                                   Chris Mitchell Royal Holloway Univ. of London, UK      C.Mitchell@rhul.ac.uk Tomoaki  Ohtsuki Keio University, Japan ohtsuki@ics.keio.ac.jp                                                       Jong-Ho  Paik KETI, South Korea paikjh@keti.re.kr   Woo Chool  Park KETI, South Korea wcpark@keti.re.kr                                                            Yi  Qian National Institute of Standards and Technology Gaithersburg, MD, USA yqian@nist.gov   lkyeun  Ra Univ. of Colorado at Denver, USA ilkyeun.Ra@cudenver.edu                                                  Byeong-Hee  Roh Ajou University, South Korea bhroh@ajou.ac.kr   Intae  Ryoo Kyung Hee Univ., South Korea itryoo@khu.ac.kr                                                              Hyundong Shin Kyung Hee Univ., South Korea hshin@khu.ac.kr   Sung  Y.  Shin South Dakota St. Univ. at Brookings, USA sung.shin@sdstate.edu                                                       Takashi Shono Intel Corporation, Japan takashi.shono@intel.com   Lei Shu Osaka University, Japan lei.shu@ieee.org                                                                Keizo  Sugiyama KDDI R&D Labs Inc., Japan sugiyama@kddilabs.jp   Tetsuya Shimamura Saitama University, Japan shima@sie.ics.saitama-u.ac.ip                                             Athanasios (Thanos) Vasilakos University of Western Macedonia, Greece vasilako@ath.forthnet.gr   Jacques  Wainer The Instituto de Computação da UNICAMP, Brazil wainer@ic.unicamp.br                                                       Honggang  Wang University of Massachusetts, North Dartmouth, USA hwang1@umassd.edu   Shuozhong  Wang Shanghai University, China shuowang@shu.edu.cn                                                      Song  Wang La Trobe Univ., Australia Song.Wang@latrobe.edu.au   Xinbing  Wang Shanghai Jiaotong University, Shanghai, China xwang8@sjtu.edu.cn                                                         Lonnie  R.  Welch Ohio Univ., USA welch@ohio.edu   Seong-Moo Yoo The University of Alabama, Huntsville, USA yoos@eng.uah.edu                                                            Yan (Josh)  Zhang Simula Research Laboratory, Norway yanzhang@ieee.org   Lin  Zhang Tsinghua University, Beijing, China linzhang@tsinghua.edu.cn                                                  Qian  Zhang Hong Kong University of Science and Technology Hong Kong qianzh@cse.ust.hk   Liang  Zhou Technical University of Munich, Germany liang.zhou@ieee.org