期刊名称：ADVANCES IN MATERIALS SCIENCE AND ENGINEERING ISSN： 1687-8434 出版频率： Continuous publication 出版社： HINDAWI LTD, ADAM HOUSE, 3RD FLR, 1 FITZROY SQ, LONDON, ENGLAND, W1T 5HF   出版社网址： http://www.hindawi.com/ 期刊网址： http://www.hindawi.com/journals/amse/ 影响因子： 1.726 主题范畴： MATERIALS SCIENCE, MULTIDISCIPLINARY 变更情况： 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal ISSN: 1687-8434 (Print) ISSN: 1687-8442 (Online) doi:10.1155/5928 About this Journal Advances in Materials Science and Engineering is a peer-reviewed, open access journal that publishes original research articles as well as review articles in all areas of materials science and engineering. The most recent Impact Factor for Advances in Materials Science and Engineering is 0.500 according to 2012 Journal Citation Reports released by Thomson Reuters (ISI) in 2013. Abstracting and Indexing The articles of Advances in Materials Science and Engineering are included in the following databases/resources: Academic OneFile Academic Search Alumni Edition Academic Search Complete Academic Search Research and Development Aluminium Industry Abstracts Applied Science and Technology Source Ceramics Abstracts/World Ceramics Abstracts Chemical Abstracts Service (CAS) CNKI Scholar Computer Science Index Copper Technical Reference Library Corrosion Abstracts CSA Materials Research Database with METADEX CSA Technology Research Database Current Abstracts Current Contents/Engineering, Computing and Technology Directory of Open Access Journals (DOAJ) EBSCO MainFile EBSCOhost Connection Engineered Materials Abstracts Environmental Engineering Abstracts Expanded Academic Index Google Scholar InfoTrac Custom journals INSPEC J-Gate Portal Journal Citation Reports: Science Edition Materials Business File Materials Science Citation Index METADEX Polymer Library Professional ProQuest Central ProQuest Engineering Collection ProQuest Materials Science Collection ProQuest Research Library ProQuest SciTech Collection ProQuest Technology Collection Science Citation Index Expanded Scopus Technology and Management (TEMA Database) TOC Premier Aims and Scope Advances in Materials Science and Engineering is a peer-reviewed, open access journal that publishes original research articles as well as review articles in all areas of materials science and engineering. Contact Information Email Addresses Editorial Office: amse@hindawi.com Postal Addresses Hindawi Publishing Corporation 410 Park Avenue 15th Floor, #287 pmb New York, NY 10022 USA Hindawi Publishing Corporation Cairo Free Zone Road 5, Block E Nasr City, Cairo 11816 Egypt Fax Numbers New York, USA +1-212-409-8818 Philadelphia, USA +1-215-893-4392 Amsterdam, The Netherlands +31-20-5248282 Brussels, Belgium +32-2-7062424 Paris, France +33-1-53013737 Milan, Italy +39-02-95441264 Zurich, Switzerland +41-44-2742823 London, England +44-2076917066 Germany +49-3221-10899-1460 Sydney, Australia +61-29-4751375 Tokyo, Japan +81-3-44965310 Instructions to Authors Submission Manuscripts should be submitted by one of the authors of the manuscript through the online Manuscript Tracking System. Regardless of the source of the word-processing tool, only electronic PDF (.pdf) or Word (.doc, .docx, .rtf) files can be submitted through the MTS. There is no page limit. Only online submissions are accepted to facilitate rapid publication and minimize administrative costs. Submissions by anyone other than one of the authors will not be accepted. The submitting author takes responsibility for the paper during submission and peer review. If for some technical reason submission through the MTS is not possible, the author can contact amse@hindawi.com for support. Terms of Submission Papers must be submitted on the understanding that they have not been published elsewhere and are not currently under consideration by another journal published by Hindawi or any other publisher. The submitting author is responsible for ensuring that the article's publication has been approved by all the other coauthors. It is also the authors' responsibility to ensure that the articles emanating from a particular institution are submitted with the approval of the necessary institution. Only an acknowledgment from the editorial office officially establishes the date of receipt. Further correspondence and proofs will be sent to the author(s) before publication unless otherwise indicated. It is a condition of submission of a paper that the authors permit editing of the paper for readability. All enquiries concerning the publication of accepted papers should be addressed to amse@hindawi.com. Peer Review All manuscripts are subject to peer review and are expected to meet standards of academic excellence. Submissions will be considered by an editor and “if not rejected right away” by peer-reviewers, whose identities will remain anonymous to the authors. Article Processing Charges Advances in Materials Science and Engineering is an open access journal. Open access charges allow publishers to make the published material available for free to all interested online visitors. For more details about the article processing charges of Advances in Materials Science and Engineering, please visit the Article Processing Charges information page. Units of Measurement Units of measurement should be presented simply and concisely using System International (SI) units. Title and Authorship Information The following information should be included Paper title Full author names Full institutional mailing addresses Email addresses Abstract The manuscript should contain an abstract. The abstract should be self-contained and citation-free and should not exceed 200 words. Introduction This section should be succinct, with no subheadings. Materials and Methods This part should contain sufficient detail so that all procedures can be repeated. It can be divided into subsections if several methods are described. Results and Discussion This section may each be divided by subheadings or may be combined. Conclusions This should clearly explain the main conclusions of the work highlighting its importance and relevance. Acknowledgments All acknowledgments (if any) should be included at the very end of the paper before the references and may include supporting grants, presentations, and so forth. References Authors are responsible for ensuring that the information in each reference is complete and accurate. All references must be numbered consecutively and citations of references in text should be identified using numbers in square brackets (e.g., “as discussed by Smith [9]”; “as discussed elsewhere [9, 10]”). All references should be cited within the text; otherwise, these references will be automatically removed. Preparation of Figures Upon submission of an article, authors are supposed to include all figures and tables in the PDF file of the manuscript. Figures and tables should not be submitted in separate files. If the article is accepted, authors will be asked to provide the source files of the figures. Each figure should be supplied in a separate electronic file. All figures should be cited in the paper in a consecutive order. Figures should be supplied in either vector art formats (Illustrator, EPS, WMF, FreeHand, CorelDraw, PowerPoint, Excel, etc.) or bitmap formats (Photoshop, TIFF, GIF, JPEG, etc.). Bitmap images should be of 300 dpi resolution at least unless the resolution is intentionally set to a lower level for scientific reasons. If a bitmap image has labels, the image and labels should be embedded in separate layers. Preparation of Tables Tables should be cited consecutively in the text. Every table must have a descriptive title and if numerical measurements are given, the units should be included in the column heading. Vertical rules should not be used. Proofs Corrected proofs must be returned to the publisher within 2-3 days of receipt. The publisher will do everything possible to ensure prompt publication. It will therefore be appreciated if the manuscripts and figures conform from the outset to the style of the journal. Copyright Open Access authors retain the copyrights of their papers, and all open access articles are distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution and reproduction in any medium, provided that the original work is properly cited. The use of general descriptive names, trade names, trademarks, and so forth in this publication, even if not specifically identified, does not imply that these names are not protected by the relevant laws and regulations. While the advice and information in this journal are believed to be true and accurate on the date of its going to press, neither the authors, the editors, nor the publisher can accept any legal responsibility for any errors or omissions that may be made. The publisher makes no warranty, express or implied, with respect to the material contained herein. Disclosure Policy A competing interest exists when professional judgment concerning the validity of research is influenced by a secondary interest, such as financial gain. We require that our authors reveal any possible conflict of interests in their submitted manuscripts. If there is no conflict of interests, authors should state that “The author(s) declare(s) that there is no conflict of interests regarding the publication of this article.” Editorial Board Editorial Board Konstantinos G. Anthymidis, Technical University of Serres, Greece Robert S. Averback, University of Illinois at Urbana-Champaign, USA Amit Bandyopadhyay, Washington State University, USA Z. Barber, University of Cambridge, United Kingdom Yucel Birol, The Scientific & Technological Research Council of Turkey, Turkey Susmita Bose, Washington State University, USA Steve Bull, Newcastle University, United Kingdom Peter Chang, Agriculture and Agri-Food Canada, Canada Daolun Chen, Ryerson University, Canada Manish U. Chhowalla, Rutgers University, USA Martin Crimp, Michigan State University, USA Jie Dai, DSO National Laboratories, Singapore C. K. Das, Indian Institute of Technology, India J. Paulo Davim, University of Aveiro, Portugal Seshu Babu Desu, Binghamton University, USA Yong Ding, Georgia Institute of Technology, USA Chunying Duan, State Key Laboratory of Fine ChemicalsDalian University of Technology, China Nadia El-Masry, North Carolina State University, USA Sergi Gallego, University of Alicante, Spain John W. Gillespie, University of Delaware, USA Hiroki Habazaki, Hokkaido University, Professor, Japan Richard Hennig, Cornell University, USA Dachamir Hotza, Federal University of Santa Catarina, Brazil Chun-Hway Hsueh, National Taiwan University, Taiwan Rui Huang, The University of Texas at Austin, USA Shyh-Chin Huang, National Taiwan University of Science and Technology, Taiwan Wei Huang, Nanjing University of Aeronautics and Astronautics, China Jacques Huot, Université du Québec à Trois-Rivières, Canada William A. Jesser, University of Virginia, USA Jaehwan Kim, Inha University, Korea S. Komarneni, Pennsylvania State University, USA Prashant Kumta, University of Pittsburgh, USA Pavel Lejcek, Academy of Sciencesof the Czech Republic, Czech Republic Markku Leskela, University of Helsinki, Finland Bin Li, National University of Defense Technology, China Hai Lin, University of Science and Technology Beijing, China Yuanhua Lin, Tsinghua University, China Zhimin Liu, Chinese Academy of Sciences, China Meilin Liu, Georgia Institute of Technology, Georgia Yuan Liu, Tsinghua University, China Gang Liu, Beijing University of Posts and Telecommunications, China Ying Liu, University of Illinois at Chicago, USA Tao Liu, East China University of Science and Technology, China Jun Liu, Jiangsu University, China Maria Antonietta Loi, University of Groningen, The Netherlands Hai Lu, Nanjing University, China Peter Majewski, University of South Australia, Australia Abdel Salam H. Makhlouf, Max Planck Institute of Colloids and Interfaces, Germany S. Miyazaki, University of Tsukuba, Japan Paul Munroe, University of New South Wales, Australia Korukonda L. Murty, North Carolina State University, USA Ali Nazari, AmirKabir University of technology, Iran Luigi Nicolais, University of Naples, Italy Tsutomu Ohzuku, Osaka City University, Japan Xiaoqing Pan, University of Michigan, USA Ganapathiraman Ramanath, Rensselaer Polytechnic Institute, USA Raju V. Ramanujan, Nanyang Technological University, Singapore Manijeh Razeghi, Northwestern University, USA Mohd Sapuan Salit, Universiti Putra Malaysia, Malaysia Chinnappa Sanjeeviraja, Alagappa University, India Jainagesh A. Sekhar, University of Cincinnati, USA Jiangbo Sha, Beijing University of Aeronautics and Astronautics, China Liyuan Sheng, Shenzhen Institute, Peking University, China You Song, Nanjing University, China Aloysius Soon, Yonsei University, Korea Charles C. Sorrell, University of New South Wales, Australia Steven L. Suib, University of Connecticut, USA Sam-Shajing Sun, Norfolk State University, USA Wen-Hua Sun, Chinese Academy of Sciences, China Weihua Tang, Nanjing University of Science and Technology, China Achim Trampert, Paul-Drude-Institut für Festköperelektronik, Germany An-Pang Tsai, Tohoku University, Japan Vladimir Tsukruk, Georgia Institute of Technology, USA Krystyn Van Vliet, Massachusetts Institute of Technology, USA Rui Vilar, Technical University of Lisbon, Portugal Kunpeng Wang, Shandong University, China Min Wang, China University of Petroleum, China Jörg M K Wiezorek, University of Pittsburgh, USA Wei Wu, DuPont Central Research and Development, USA Gongnan Xie, Northwestern Polytechnical University, China Aiguo Xu, Institute of Applied Physics and Computational Mathematics, China Jianqiao Ye, Lancaster University, United Kingdom Yadong Yin, University of California, Riverside, USA Tao Zhang, Institute of Metal Research, Chinese Academy of Sciences, China Bin Zhang, Tianjin University, China Jun Zhang, Inner Mongolia University, China Ming-Xing Zhang, University of Queensland, Australia Guan-Jun Zhang, Xi'an Jiaotong University, China Jing Zhang, Donghua University, China Kai Zhang, North China Electrical Power University, China Kai Zhang, Business School Shenzhen University, China Rui Zhang, Harbin Institute of Technology, China Yufeng Zhang, Harbin Institute of Technology, China Jian Zhang, Nanyang Technological University, Singapore Editorial Workflow The following is the editorial workflow that every manuscript submitted to the journal undergoes during the course of the peer-review process. The entire editorial workflow is performed using the online Manuscript Tracking System. Once a manuscript is submitted it is sent to an appropriate Editor based on the subject of the manuscript and the availability of the Editors. If the Editor finds that the manuscript may not be of sufficient quality to go through the normal peer review process, or that the subject of the manuscript may not be appropriate for the journal’s scope, the manuscript shall be rejected with no further processing. If the Editor finds that the submitted manuscript is of sufficient quality and falls within the scope of the journal, they would assign the manuscript to a minimum of 2 and a maximum of 5 external reviewers for peer-review. The reviewers submit their reports on the manuscripts along with their recommendation of one of the following actions to the Editor: Publish Unaltered Consider after Minor Changes Consider after Major Changes Reject: Manuscript is flawed or not sufficiently novel When all reviewers have submitted their reports, the Editor can make one of the following editorial recommendations: Publish Unaltered Consider after Minor Changes Consider after Major Changes Reject If the Editor recommends “Publish Unaltered,” the manuscript is accepted for publication. If the Editor recommends “Consider after Minor Changes,” the authors are notified to prepare and submit a final copy of their manuscript with the required minor changes suggested by the reviewers. The Editor reviews the revised manuscript after the minor changes have been made by the authors. Once the Editor is satisfied with the final manuscript, the manuscript can be accepted. If the Editor recommends “Consider after Major Changes,” the recommendation is communicated to the authors. The authors are expected to revise their manuscripts in accordance with the changes recommended by the reviewers and to submit their revised manuscript in a timely manner. Once the revised manuscript is submitted, the Editor can then make an editorial recommendation which can be “Publish Unaltered,” “Consider after Minor Changes,” or “Reject.” If the Editor recommends rejecting the manuscript, the rejection is immediate. Also, if two of the reviewers recommend rejecting the manuscript, the rejection is immediate. The editorial workflow gives the Editors the authority to reject any manuscript because of inappropriateness of its subject, lack of quality, or incorrectness of its results. The Editor cannot assign himself/herself as an external reviewer of the manuscript. This is to ensure a high-quality, fair, and unbiased peer-review process of every manuscript submitted to the journal, since any manuscript must be recommended by one or more (usually two or more) external reviewers along with the Editor in charge of the manuscript in order for it to be accepted for publication in the journal. The name of the Editor recommending the manuscript for publication is published with the manuscript to indicate and acknowledge their invaluable contribution to the peer-review process and the indispensability of their contributions to the running of the journals. The peer-review process is single blinded; that is, the reviewers know who the authors of the manuscript are, but the authors do not have access to the information of who the peer reviewers are. Every journal published by Hindawi has an acknowledgment page for the researchers who have performed the peer-review process for one or more of the journal manuscripts in the past year. Without the significant contributions made by these researchers, the publication of the journal would not be possible.