期刊名称：CURRENT APPLIED PHYSICS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
Current Applied Physics is an international journal which covers all the fields of applied science investigating the
physics of the advanced materials for future applications.
Other areas covered: Experimental and theoretical aspects of advanced materials and devices dealing with synthesis or structural chemistry, physical and electronic properties, photonics, engineering application and uniquely pertinent measurement or analytical techniques. Current Applied Physics covers physics, chemistry and materials science, including bio-materials, with their engineering aspects. This journal is a truly interdisciplinary journal opening a forum for the scientists of all related fields, a unique point of the journal discriminating it from other worldwide and/or Pacific Rim applied physics journals.
Regular research papers, letters and review articles with contents meeting the scope of the journal will be considered for publication after peer review.
Instructions to Authors
Aims & Scope
Current Applied Physics is an international journal which covers the whole fields of applied science investigating the physics of the advanced materials for future applications. Other areas covered: Experimental and theoretical aspects of advanced materials and devices dealing with synthesis or structural chemistry, physical and electronic properties, photonics, engineering application and uniquely pertinent measurement or analytical techniques. Current Applied Physics covers physics, chemistry and materials science, including bio-materials, with their engineering aspects. Current Applied Physics is a truly interdisciplinary journal opening a forum for the scientists of all related fields, a unique point of the journal discriminating if from other worldwide and/or Pacific Rim applied physics journals.
Author enquiries
How to submit
Authors should submit three clear copies of the manuscript, including original illustrations directly to an appropriate Regional Editor. The manuscript, including the abstract, references, and figure captions, should be neatly typed in English, double- spaced, on one side only. All pages of the manuscript must be numbered, beginning from the title page. Manuscripts sent to authors for revision should be returned to the Regional Editor within three months. A manuscript returned later than this will generally be regarded as newly submitted and will receive a new receipt date.
Article Types
Regular research papers, letters and review articles with contents meeting the scope of the journal will be considered for publication after peer review. A cover letter should specify authors, title, the corresponding author's name, complete postal address, telephone and fax numbers and the e-mail address. If possible, also provide details on other authors, especially if the corresponding author is planning to be away for a period when the manuscript is under review or in production at the Publisher. Referee suggestions are particularly welcome when a manuscript treats a highly specialized subject. The editors are, of course, not constrained to select a referee from those suggested. Unless otherwise stated, submission of a manuscript will be understood to mean that the paper has been neither copyrighted, classified, published, nor is being considered for publication elsewhere.
Structure
Please adhere to the following order of presentation: Title, Author(s), Affiliation(s), Abstract, PACS codes and Keywords, Main text, Acknowledgements, Appendices, References, Figure captions, Tables. PACS numbers for subject classification are recommended.
Electronic text and figures
The publisher requires an electronic version of your accepted manuscript. If there is not already a copy of this (on diskette) with the journal editor at the time the manuscript is being refereed, you will be asked to send a file with the text of the revised manuscript. All major text processing packages can be handled, but text in either LaTeX, Word or WordPerfect is preferred. The Publisher welcomes electronic graphics accompanying accepted manuscripts. For specific enquiries on the preparation of electronic artwork, consult http://www.elsevier.com/locate/authorartwork.
Other enquiries
For enquiries relating to the status of accepted articles through our Online Article Status Information System (OASIS), author Frequently Asked Questions and any other enquiries relating to Elsevier Science, please consult http://www.elsevier.com/locate/authors/
Contact details for questions arising after acceptance of an article, especially those relating to proofs, are provided when an article is accepted for publication.
Author benefits
No page charges. Publishing in Current Applied Physics is free. Free offprints. The corresponding author will receive 25 offprints free of charge. An offprint order form will be supplied by the Publisher for ordering any additional paid offprints. Discount. Contributors to Elsevier Science journals are entitled to a 30% discount on all Elsevier Science books.
Editorial Board
- Editor-in-Chief
- Yung Woo Park, Department of Physics, Seoul National University, Seoul 151-742, Korea Tel: +82 28737037, Email: ywpark@phya.snu.ac.kr
- Regional Editors
- E.V. Antipov, Inorganic Chemistry Department, Faculty of Chemistry, Moscow State University, 119899, Moscow, Russia Tel: +7 095 939 3375, Email: antipov@icr.chem.msu.ru
Arthur J. Epstein, Department of Physics and Chemistry, Ohio State University, 174 West 18th Avenue Columbus, Ohio 43210-1106, USA Tel: +1 614 292 1133, Fax: +1 614 292 3706, Email: epstein.2@osu.edu
Seiichi Kagoshima, Department of Basic Science, Graduate School of Arts and Sciences, University of Tokyo, Komaba 3-8-1, Meguro-ku, Tokyo 153-8902, Japan Tel: +81 3 5454 6737, Fax: +81 3 5454 4331, Email: kagosima@mail.ecc.u-tokyo.ac.jp
William I. Milne, Department of Electrical Engineering, Cambridge University, Trumpington Street, Cambridge CB2 1PZ, United Kingdom Tel: +44 1223 332757, Fax: +44 1223 766207, Email: wim@eng.cam.ac.uk
Siegmar Roth, Max Planck-Institute f¨¹r Festkorperforschung Heisenbergstrasse 1, D-70569 Stuttgart, Germany Tel: +49 711 689 1434, Fax: +49 711 689 1010, Email: s.roth@fkf.mpg.de
Yasuo Wada, Waseda University, Nanotechnology Research Laboratory, Wasedatsyurumaki-cho, Shinjuku-ku, Tokyo 162-0041, Japan Tel: +81 35286 8326, Fax: 81 33205 3182, Email: wada@waseda.jp
C.N. Whang, The Korean Physical Society, Yuksam-Dong 635-4, Kangnam-Ku, Seoul 135-703, Korea Tel: +82 2556 4737, Fax: 82 2554 1643, Email: office@mulli.kps.or.kr
- International Advisory Editorial Board (IAEB) Members
- M. Aono, Osaka University, Japan
C.W. Paul Chu, TCSOH/UH, USA
E.M. Conwell, U. Rochester, USA
L.P. Gor'kov, NHMFL/FSU, USA
A.J. Heeger, UCSB, USA
D. Jerome, University Paris, France
G. MacDiarmid, University of Pennsylvania, USA
G.A. Sawatzky, University of British Columbia, Canada
J.R. Schrieffer, NHMFL/FSU, USA
H. Shirakawa, University Tsukuba, Japan
F. Spaepen, Harvard University, USA
K. Suzuki, Tohoku University, Japan
M. Tachiki, NRIM, Japan
S. Tanaka, ISTEC, Japan
F.S. Wang, Chinese Academy of Science, PRC
J. Williams, Australian National University, Australia
T. Yamabe, NIAS, Japan
Z.X. Zhao, Inst. of Phys., CAS, PRC
D.B. Zhu, Inst. of Chem., CAS, PRC
- Editorial Board (EB) Members
- H. Asahi, Osaka University, Japan
P. Bernier, Montpellier II University, France
B.R. Cho, Korea University, Japan
H. Fukuyama, University of Tokyo, Japan
E. Gough, Birmingham University, UK
A.L. Greer, Cambridge University, UK
T. Hashizume, Hitachi, ARL, Japan
A. Inoue, Tohoku University, Japan
A.B. Kaiser, Victoria U of Wellington, New Zealand
Y. Kawazoe, Tohoku University, Japan
T.W. Kim, Hongik University, Korea
K. Kitazawa, University of Tokyo, Japan
C.E. Lee, Korea University, South Korea
I.-W. Lyo, Yonsei University, South Korea
S. Maekawa, Tohoku University, Japan
D.W. Moon, KRISS, South Korea
M. Nechtschein, CEA/CNRS, Grenoble, France
K.S. No, KAIST, South Korea
T. Sambongi, Hokkaido University, Japan
R.J. Smith, Montana State University, USA
X. Sun, Fudan University, PRC
Y. Yao, Tohoku University, Japan
E. Yoon, Seoul National University, South Korea
K. Yoshino, Osaka University, Japan
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