期刊名称：IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS (MWCL) is published monthly with the purpose of providing fast publication of original and significant contributions relevant to all aspects of microwave/millimeter-wave technology, with emphasis on devices, components, circuits, guided wave structures, systems and applications covering the frequency spectrum from microwave and beyond, including submillimeter-waves and infrared. Publication time will be two months from the end of the month in which it was received provided the author responds immediately to all communications.
Instructions to Authors
Information for Authors
The IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS (MWCL) is published monthly with the purpose of providing fast publication of original and significant contributions relevant to all aspects of microwave/millimeter-wave technology, with emphasis on devices, components, circuits, guided wave structures, systems and applications covering the frequency spectrum from a few 100 MHz to submillimeter-waves and infrared. Publication time will be three months from the end of the month in which the paper has been accepted, provided the author responds swiftly to all communications. Once a manuscript has been received by the editorial office, acknowledgment letters will be sent to the authors. Proofs of accepted papers will be sent to authors. Once a paper is accepted, any changes to the technical content by the author will cause the paper to be reviewed again.
I. Paper Submission in Electronic Form
To reduce time from submission to publication of papers, the editorial office accepts manuscripts only in electronic form as .pdf files and all communications with authors will be via email. The files must not be larger than 1MB and no *.zip files are accepted. Submissions should be sent to EditorialAssistant@oai.org. Authors must have a reliable email address, since all communications will be by email. All papers must use the templates provided under http://www.ieee.org/web/publications/authors/transjnl/index.html (Template for all Transactions (except IEEE Transactions on Magnetics), two-column template; can also be requested from the editorial office). Figures, graphs and all other necessary information for reviewing the manuscript must be included in this file (as opposed to being attached to it as separate files) and placed at appropriate locations within the text rather than at the end:
- Figures should be large enough to be easily readable on a computer screen and on paper when printed out.
- The print version of the paper will be in black and white, but color figures may be used in the electronic version of the paper.
- Axes should be labeled with large lettering.
- Whenever possible, theory and corresponding experimental results should be printed on the same graph for easy comparison.
- Follow the Guidelines for Author-Supplied Electronic Text and Graphics available for download at the above website.
- The maximum paper length is 3 pages, including paper title, author affiliation, references, etc. The font size is specified in the templates. TeX and LaTeX users must use scalable fonts rather than bitmapped fonts to allow easy reading of .pdf files on the computer screen.
Note: Manuscripts that are related to material submitted to or published at conferences are considered only if the content is significantly updated or contains material of substantially complementary nature. Authors must reference all of their previous papers that are similar. Please attach .pdf files of previous papers and clearly state (on a separate page) the difference with respect to the current submission. Failure to disclose prior papers by the authors that are similar will be returned.
II. Author Check List
At the time of submission, we require the submission of the author check list. An updated version is available at http://www.mtt.org/publications/Letters/AuthorChecklist_MWCL.pdf or http://www.mtt.org/publications/Letters/AuthorChecklist_MWCL.doc (or from the editorial office). The check list may be submitted as a separate .pdf or .doc file.
III. Copyright Form
At the time of submission, a signed copyright form must be emailed as a separate .pdf or faxed to the editor. The copyright form is available from http://www.ieee.org/organizations/pubs/transactions/information.htm (or from the editorial office).
IV. Final Submission Format
After a manuscript has been accepted for publication, the author will be requested to provide an electronic copy of the final version of the manuscript. TEX and LATEX are the preferred formats for this final submission, although some other formats are also acceptable, such as Microsoft Word. Note: Although we require a .pdf file of the manuscript for the review process, this format is not acceptable (neither is .ps) for the final submission. Therefore, if you have followed the guidelines for electronic submissions as given above, your manuscript is written already in one of the accepted file formats and you can quickly respond to send in the final version of the manuscript, if it is accepted for publication.
Some additional guidelines must, however, be followed for the submission of the final manuscript in electronic form:
- The header information should accompany the transmitted files, clearly identifying the name of the Journal, author's name and title of the manuscript.
- Include all macros (/def) that are required to produce your manuscript (TEX and LATEX).
- IEEE Transaction/Journal style dictates a 21-pica (3.5 inch) column width. If mathematical expressions are produced with this in mind, they are more aesthetically pleasing in the final version.
- Figures and tables must be submitted as separate files in .ps, .eps or .tiff format.
Instructions to Authors
IEEE.pdf
Editorial Board
Editors
Editor-in-Chief
Dr. George E. Ponchak
Email: George.Ponchak@ieee.org
Associate Editors
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Dr. Lei ZHU
Associate Professor
Division of Communication Engineering
School of Electrical & Electronic Engineering
Nanyang Technological University
S2.2-B2-16, Nanyang Avenue, Singapore 639798
Tel.: 6790-4338
Fax: 6792-0415
e-mail: ezhul@ntu.edu.sg
Jae-Sung Rieh, Ph.D.
Associate Professor
School of Electrical Engineering
Korea University, Seoul, Korea
+82-2-3290-3257 (phone)
+82-2-921-0544 (fax)
jsrieh@korea.ac.kr
Costas D. Sarris
Assistant Professor
University of Toronto
10 King's College Rd.
Toronto, ON M5S 3G4
Canada
Ph: 416-946-8738
cds@waves.utoronto.ca
Prof. Dr.-Ing. Georg Boeck
Technische Universitaet Berlin / Berlin University of Technology
Fachgebiet Mikrowellentechnik / Microwave Engineering
Einsteinufer 25, Sekr. HFT 5-1
10587 Berlin, Germany
Tel.: +49(0)30/314-26895
Fax: +49(0)30/314-26893
Email: boeck@tu-berlin.de
N. Scott Barker
Associate Professor
University of Virginia
351 McCormick Road, P.O. Box 400743
Charlottesville, VA, 22904-4743
Tel: (434) 924-6783
Fax: (434) 924-8818
Email: barker@virginia.edu
Kwok-Keung M. Cheng
Professor
The Chinese University of Hong Kong
Rm 430, Ho Sin Hang Engineering Building
Shatin, Hong Kong
Tel: +852 2609 8269
Email: kkcheng@ee.cuhk.edu.hk | Editor-in-Chief
George E. Ponchak
NASA Glenn Research Center
21000 Brokpark Rd
Cleveland, OH 44135, USA
Phone: +1 216 433 3504
Fax: +1 216 433 8705
Email: george.ponchak@ieee.org
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