期刊名称:TRIBOLOGY LETTERS

ISSN:1023-8883
版本:SCI-CDE
出版频率:Continuous publication
出版社:SPRINGER/PLENUM PUBLISHERS, 233 SPRING ST, NEW YORK, USA, NY, 10013
  出版社网址:http://www.wkap.nl/
期刊网址:http://www.kluweronline.com/issn/1023-8883
影响因子:3.106
主题范畴:ENGINEERING, CHEMICAL;    ENGINEERING, MECHANICAL

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

 

 

 

Tribology Letters is devoted to the development of the science of Tribology and to its applications. It also serves as the depository for new information on the mechanical properties of surfaces. These include friction, lubrication, wear, adhesion and hardness. The aim of the journal is to facilitate communication and exchange of seminal ideas among the thousands of practitioners who are engaged worldwide in the pursuit of tribology-based science and technology. We hope to encourage the cross-fertilization of ideas by rapid dissemination of the results of frontier research and development on a global basis.

 


Instructions to Authors


        1.  Manuscripts may be submitted in the form of Short Communications or Letters. All should treat some aspect of Tribology and should be sent in triplicate to one of the Editors-in-Chief:

Professor Nicholas D. Spencer
Laboratory for Surface Science & Technology
Department of Materials, ETH-Zürich, NO H64
CH-8092 Zürich
Switzerland

Tel.: +41 1 632 5850
Fax.: +41 1 633 1027
E-mail:
nspencer@surface.mat.ethz.ch

or

Professor Wilfred T. Tysoe
Department of Chemistry
University of Wisconsin-Milwaukee
P.O. Box 413
Milwaukee, Wisconsin 53201
USA

Tel.: +1 414 229 5036
Fax.: +1 414 229 5036
E-mail:
wtt@alpha2.csd.uwm.edu

         2. Submission is a representation that the manuscript has not been published previously and is not currently under consideration for publication elsewhere. A statement transferring copyright from the authors (or their employers, if they hold the copyright) to Kluwer Academic/Plenum Publishers will be required before the manuscript can be accepted for publication. The Editor will supply the necessary forms for this transfer. Such a written transfer of copyright, which previously was assumed to be implicit in the act of submitting a manuscript, is necessary under the U.S. Copyright Law in order for the publisher to carry through the dissemination of research results and reviews as widely and effectively as possible.

       3.  All manuscripts must be written in English.

       4.  All manuscripts should be typed with double spacing and wide margins and should include the following items:

A full descriptive title and a short title for the running headlines.

A list of the authors with their affiliations and full postal addresses.

An abstract of about 50 words; keywords (index terms).

Acknowledgements (if any) and references, which should be placed at the end of the manuscript before any tables and figures.

A list of keywords.

      5.  Tables (if any) should be numbered consecutively and each should have a caption.

      6. Originals or good prints of all figures and diagrams in the manuscript should be submitted with the manuscript itself.

       7. References should be given in numerical order as they appear in the manuscript text and cited in the following manner:

For a journal paper:
[1] W.T. Tysoe, N.D. Spencer and R.M. Lambert, Surf. Sci. 120 (1982) 413.

For a contributed volume paper:
[2] A.M. Bradshaw, in: Surface and Defect Properties of Solids, Vol. 3, eds. M.W. Roberts and J.M. Thomas (The Chemical Society, London, 1974) ch. 5.

For a monograph:
[3] G.A. Somorjai, Introduction to Surface Chemistry and Catalysis (Wiley-Interscience, New York, 1994).

      8.  Footnotes should be avoided whenever possible and (if any) integrated in the text.

       9.  All manuscripts will be subject to peer reviewing by at least two expert referees.

       10.  After acceptance of a manuscript for publication, the Publisher will take care of the technical editing and of the proofreading. All correspondence then should be sent to the Publisher. Electronic submission of accepted contributions will speed up publication of your paper. Files may be e-mailed to the editors upon acceptance. Note the title and corresponding author‘s name, along with the operating system, software, and version number used to create your file, in your e-mail.

         11. No page charge is made. 25 reprints of each article published in this journal will be supplied free of charge. Additional reprints can be ordered from the publisher at the normal prices of the journal. Forms with the current price schedule are supplied by the editors upon acceptance.

 

 


Editorial Board


Editor-in-Chief:
Nicholas D. Spencer
Dept. of Materials, ETH-Zürich, Switzerland
Wilfred T. Tysoe
Dept. of Chemistry, University of Wisconsin, Milwaukee, USA

Managing Editor:
Gabor A. Somorjai
Dept. of Chemistry, University of California, Berkeley, USA

Editorial Board:
Tom Bell, School of Metallurgy and Materials, The University of Birmingham, UK; Bharat Bhushan, Dept. of Mechanical Engineering, The Ohio State University, Columbus, USA; David Bogy, Dept. of Mechanical Engineering, University of California, Berkeley, USA; Brian J. Briscoe, Dept. of Chemical Engineering & Chemical Technology, Imperial College, London, UK; Yip-Wah Chung, Dept. of Materials Science & Engineering, Northwestern University, Evanston, IL, USA; Paul Fleischauer, The Aerospace Corporation, Los Angeles, CA, USA; Eduard H. Freitag, Uster, Switzerland; Michael N. Gardos, Raytheon Systems Company, El Segundo, CA, USA; Andrew Gellman, Dept. of Chemical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA; Jean-Marie Georges, Laboratoire de Tribologie et Dynamique des Systèmes, Institut Universitaire de France, Ecully Cedex, France; Steven Granick, Dept. of Materials Science, University of Illinois, Urbana, USA; Karl-Heinz Habig, Bundesamt für Materialforschung und Prüfung, Berlin, Germany; Steven Hsu, NIST, Gaithersburg, MD, USA; Ian M. Hutchings, University of Cambridge, Institute for Manufacturing, UK; Jacob Israelachvili, Dept. of Chemical Engineering, University of California, Santa Barbara, USA; Andrew Jackson, Advanced Laboratory Sciences, Exxon Mobil RE, Annandale, NJ, USA; K.L. Johnson, Jesus College, Cambridge, UK; Yoshitsugu Kimura, Vice President, Kagawa University, Takamatsu, Japan; David A. King, Dept. of Chemistry, Cambridge, UK; Peter Kotvis, Benz Oil, Inc., Milwaukee, WI, USA; Jacqueline Krim, Dept. of Physics, North Carolina State University, Rayleigh NC, USA; James L. Lauer, Center for Magnetic Recording Research (CMRR), University of California, San Diego, La Jolla, USA; Othmar Marti, Abt. Experimentelle Physik, Universität Ulm, Germany; Matthew Mate, Almaden Research Center, IBM Research Division, San Jose, CA, USA; Ernst Meyer, Institut für Physik der Universität Basel, Switzerland; Shigeyuki Mori, Faculty of Engineering, Iwate University, Japan; Scott S. Perry, Dept. of Chemistry, University of Houston, TX, USA; J.B. Pethica, Dept. of Materials, University of Oxford, UK; Richard Polizzotti, Exxon Research and Engineering Co., East Annandale, NJ, USA; Miquel Salmeron, Center for Advanced Materials, Lawrence Berkeley Laboratory, CA, USA; Irwin L. Singer, Naval Research Laboratory, Washington, DC, USA; Hugh Spikes, Dept. of Mechanical Engineering, Imperial College, London, UK; G.W. Stachowiak, Dept. of Mechanical and Materials Engineering, University of Western Australia, Nedlands, Australia; D. Tabor, Dept. of Physics, Cavendish Laboratory, Cambridge, UK; Mark Welland, Dept. of Engineering, Cambridge, UK; Ward O. Winer, George G. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, USA; Niklaus Wüthrich, Technikum Winterthur, Switzerland; Karlheinz Zum Gahr, Institut für Werkstoffkunde II, Universität Karlsruhe, Germany

 

 


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