期刊名称：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
Journal of Materials Science: Materials in Electronics
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the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics covering the ground between the fundamental science, such as semiconductor physics, and work concerned solely with applications. It features not only the growth and preparation of new materials, but also their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterisation related to the whole range of applications in electronics. The Journal encourages papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials. New preparation methods such as molecular beam epitaxy, MOMBE, chemical vapour deposition techniques and bulk crystal growth are covered, while all aspects of the technology and fabrication of semiconductor devices and circuits, together with their assessment and reliability, are included. Papers on materials used in more conventional applications such as resistors, inductors, conductors, capacitors, power semiconductor devices, dielectrics, ferroelectrics, insulators and magnetic applications are equally encouraged. |
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Instructions to Authors
Aims, Scope and Submission of papers
- The Journal of Materials Science: Materials in Electronics is published twelve times annually. It publishes peer-reviewed research papers on both conventional and new preparation methods and applications of materials in the field of electronics. Submissions should be sent in triplicate to: Professor A. Willoughby, Engineering Materials, Room 3009, Eustice Building, The University, Southampton, SO17 1BJ, UNITED KINGDOM; E-mail: gsr@soton.ac.uk.
- TheJournal of Materials Science: Materials in Electronics also publishes Review Papers providing an overview of specific subject areas within the Aims and Scopes of the journal. Submission of Review Papers should be sent in triplicate to Professor Safa Kasap, Department of Electrical Engineering, 57 Campus Drive, University of Saskatchewan, Saskatoon, S7N 5A9, CANADA; E-mail: Kasap@engr.usask.ca. Professor Kasap welcomes ideas and suggestions for review topics as well.
- The Journal of Materials Science: Materials in Electronics is part of the Journal of Materials Science family of journals. The main Journal, the Journal of Materials Science is published bi-weekly and spans a very wide range of materials which are investigated in a variety of physical forms using many different techniques. Original research results on such international and interdisciplinary subjects such as metals, ceramics, glasses, polymers, electrical materials, composite materials, fibres, biological and biomedical materials will also be considered for publication. Review articles of topical interest are published regularly. Submissions to the Journal of Materials Science should be sent in triplicate to Professor Rees Rawlings, Kluwer Academic Publishers, 101 Philip Drive, Norwell, MA 02061, USA. Please note that the resubmission of rejected manuscripts will not be accepted.
- The Journal of Materials Science Letters is published bi-weekly. It consists of short, original communications, normally less than 1500 words. It publishes letters on the same variety of topics as the Journal of Materials Science. Submissions to Journal of Materials Science Letters should be sent in triplicate to: Professor Rees Rawlings (address above).
Copyright
Submission of an article to any of the above mentioned journals is taken to imply that it presents original, unpublished work, not under consideration for publication elsewhere. A Copyright assignment form will be sent to the authors of submitted papers prior to refereeing. This publication agreement should be completed and returned to the editorial office. The agreement becomes void if the paper is not accepted for publication in the journal. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints, photographic reproductions, microfilm or any other reproductions of similar nature, and translations.
The manuscript
- Language and style
The manuscript must be in English. Permission to reproduce previously published material must be obtained by the author prior to submission. It should be typed on paper of the following dimensions: 203x267 mm, 216x279 mm or 210x297 mm with margins of at least 25 mm. If a dot matrix printer is used, submit letter-quality text and do not justify the margins. Use double spacing throughout. On acceptance, authors are requested to provide a disc with an ASCII version of the manuscript.
- Presentation
For Journal of Materials Science, Journal of Materials Science: Materials in Electronics and Journal of Materials Science: Materials in Medicine each of the following sections should begin on separate pages: title page, abstract and keywords, text, acknowledgments, references, individual tables, figure legends. The abstract should be a brief and factual statement of the contents. This should not exceed 200 words in length. Three relevant keywords should also be submitted with the original manuscript. The main text of the paper should be divided into sections and subsections as exemplified in the headings of these "Instructions for authors".
The above format does not apply when submitting to Journal of Materials Science Letters. For this journal, the format is that of a chronologically constructed letter, which should be less than 1500 words in length.
Pages should be numbered consecutively beginning with the title page. Please adhere to these instructions carefully as improperly prepared manuscripts will be returned for alteration.
- References
References should be numbered consecutively in the text, thus: "According to a recent theory [4]..." and collected at the end of the paper in the following styles, for journals, proceedings and books, respectively:
4. A. BLACK and C. DENT, J. Mater. Sci.1 (1997) 274.
5. R. CHANG, in Proceedings of the 2nd International Conference on Fracture, Brighton, April 1997, edited by P. L. Pratt (Chapman & Hall, London, 1996) p. 306.
6. R. J. YOUNG, in "Introduction to Polymers" (Chapman & Hall, London, 1995) p. 137.
- Illustrations
All illustrations, of whatever type, should be numbered in a single sequence and referred to in the text and caption as Fig. 1, Fig. 2, etc. The author¡®s name and the figure number should be clearly shown on the front or back of each illustration. Original art-work should be sent; photocopies or any other form of copy will generally be unsuitable for reproduction in the Journals. A separate list of captions for illustrations should be provided and a note inserted in the typescript to indicate where they should appear. Figures will normally be reduced to either single (80 mm) or double (167 mm) column width and this should be remembered when the figures are labelled: a final capital-letter height of about 2 mm (after reduction) is preferred.
Line diagrams. Originals must be presented as high quality laser printed computer output. Lettering should be unambiguous, handwritten annotations are not acceptable.
Photographs. Photographs should be positive glossy prints, unmarked and not creased, and of high contrast. They must have internal scale bars. Symbols, arrows, or letters used in photographs should contrast with the background. Colour printing is available, subject to the author meeting the extra cost involved. Please note that the Publishers regret that original micrographs cannot be returned.
Units and abbreviations. SI units must be used. If unconventional units are employed (e.g., denier) appropriate conversion factors should be given.
All abbreviations should be spelt out in full on first appearance, e.g., scanning electron microscope (SEM).
Offprints
A total of 25 offprints for each article will be provided free. Extra copies can be purchased using the Offprint Order Form provided with the proofs or on acceptance of the article.
Cover photographs
The cover photographs are enlarged versions of photographs appearing in the issues. Contributors are invited to draw the Editor¡®s attention to a photograph of outstanding scientific importance. Larger copies of these illustrations may be submitted.
Editorial Board
EDITOR
Professor Arthur Willoughby
Electronic Materials Research Group
University of Southampton, UK
g.s.rood@soton.ac.uk
EDITOR: REVIEW PAPERS
Professor Safa Kasap
Department of Electrical Engineering
EDITORIAL BOARD
Professor Sadao Adachi
Department of Electronic Engineering
Gunma University, Japan
Dr. Paul Amirtharaj
Sensors and Electron Devices Directorate
U.S. Army Research Laboratory, Adelphi, Maryland, USA
Dr. H. Asahi
Institute of Scientific and Industrial Research
Osaka University, Osaka, Japan
Professor D. Bloor
School of Engineering and Applied Science
University of Durham, UK
Professor W. Bonfield
Department of Materials Science and Metallurgy
University of Cambridge, UK
Dr. P. Capper
BAE Systems Infrared Limited
Southampton, UK
Dr. W.J. Choyke
Department of Physics
University of Pittsburgh, Pennsylvania, USA
Ms. S.B. Dunkerton
TWI, Abington, UK
Dr Darrel Frear
Motorola, Tempe, Arizona, USA
Dr Jan Evans-Freeman
Centre for Electronic Materials
UMIST, Manchester, UK
Dr. J.J. Harris
Director of Technology
Thermo VG Semicon, East Grinstead, W. Sussex, UK
Professor R. Hull
University of Virginia, Charlottesville
Virgina, USA
Professor S. Irvine
Department of Chemistry
University of Wales, Bangor, UK
Professor C. Jagadish
Department of Electronic Materials Engineering
The Australian National University, Canberra, Australia
Professor David Jiles
Materials Science and Engineering Department
Iowa State University, Ames, Iowa, USA
Professor K.L. Kavanagh
Department of Physics
Simon Fraser University, Canada
Professor Patrick J. McNally
Research Institute for Networks & Communications Engineering (RINCE),
Dublin City University, Ireland
Dr. M. Mizuta
NEC Corporation, Ibaraki, Japan
Dr. P.M. Mooney
T.J. Watson Research Center
IBM Research Division, New York, USA
Professor H. Morkoc
Microelectronic Materials and Devices Laboratory
Virginia Commonwealth University, Richmond, VA, USA
Professor Hiroshi Nakayama
Department of Applied Physics
Osaka City University, Japan
Professor T. Nishinaga
Department of Electronic Engineering
The University of Tokyo, Japan
Professor E.H.C. Parker
Department of Physics
University of Warwick, UK
Professor Harry Ruda
Electronic and Photonic Materials Group
University of Toronto, Toronto, Canada
Professor M. Schulz
Institut fur Angewandte Physik
Universitat Erlange, Nurnberg, Germany
Professor R.M. Wallace
Department of Materials Science
University of North Texas
Denton, Texas, USA
Professor Neil White
Department of Electronics and Computer Science
University of Southampton, UK
Professor M. Willander
Department of Microelectronics & Nanoscience
Göteburg University, Sweden
Professor W. Yi Ming
Chinese State Bureau of Technical Supervision (CSBTS)
Beijing, China
University of Saskatchewan, Canada
kasap@engr.usask.ca
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