期刊名称：MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
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Microwave and Optical Technology Letters
Copyright 2005 Wiley Periodicals, Inc., A Wiley Company
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Microwave and Optical Technology Letters provides quick publication (3 to 6 month turnaround) of the most recent findings and achievements in high frequency technology, from RF to optical spectrum. The journal publishes original short papers and letters on theoretical, applied, and system results in the following areas.
- RF, Microwave, and Millimeter Waves
- Antennas and Propagation
- Submillimeter-Wave and Infrared Technology
- Optical Engineering
Instructions to Authors
1. Prospective authors should submit five copies of the complete manuscript (including figures) to Professor Kai Chang, Electrical Engineering Department, Texas A & M University, College Station, Texas 77843-3128, USA. Camera-ready illustrations (originals) must accompany the manuscript but be separate from it. Other correspondence should be sent to the Publisher, c/o, John Wiley & Sons, Inc., 111 River Street, Hoboken, NJ 07030.
2. Only original papers will be accepted and copyright in published papers will be vested in the publisher. No article can be published unless accompanied by a signed publication agreement, which serves as a transfer of copyright from author to publisher. A copy of that agreement, executed and signed by the author, is now required with each manuscript submission. If the article is a "work made for hire," the agreement must be signed by the employer. A copy of the agreement can be found in some issues or from the journal homepage of this journal in the Wiley website (www.interscience.wiley.com). Copies are also available from the Editor upon request.
3. The language of the journal is English.
4. Manuscripts should be submitted typed double-spaced on one side only on standard 812 3 11-inch (21.5 3 28-cm) paper with 1-inch (2.5-cm) margins. An abstract of not more than 50 words should be included. Authors should supply up to five key terms or phrases that characterize their manuscript. The maximum length of each article is five printed pages. Each printed page is equivalent to four double-spaced manuscript pages or four figures. Authors are requested to stay within these limits. The first page should contain the title, authors and addresses, email address and fax number for the corresponding author, key terms, and abstract. The paper should be reasonably subdivided into sections and, if necessary, subsections. The references should be numbered consecutively in the order of their appearance and should be complete, including authors' initials, the title of the paper, the date, page numbers, and the name of the sponsoring society. Please compile references on a separate sheet at the end of the manuscript, following the AMS style. See the examples below. Where possible, material intended for footnotes should be inserted into the text as parenthetical material. Please supply numbers and explanatory titles for all tables. Please supply legends for all figures and compile these on a separate sheet. The authors are encouraged to include diskettes with their submission, according to the instructions.
Wiley's Journal Styles Are Now in EndNote
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Download Reference Style for this Journal: If you already use EndNote, you can download the reference style for this journal.
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Reference Examples:
1. D.G. Berry, R.G. Malech, and W.A. Kennedy, The reflectarray antenna, IEEE Trans Antennas Propagat, Vol. AP-11, (1963), 645-651.
2. R.E. Munson, H. Haddad, and J. Hanlen, Microstrip reflectarray antenna for satellite communication and RCS enhancement or reduction, U.S. Patent No. 4684952, Aug. 1987.
5. Good glossy photographs are required for halftone reproductions. Figures should be professionally prepared and submitted in a form suitable for reproduction (camera-ready copy). Computer-generated graphs are acceptable only if they have been printed with a good quality laser.All color figures will be reproduced in full color in the online edition of the journal at no cost to authors. Authors are requested to pay the cost of reproducing color figures in print. Authors are encouraged to submit color illustrations that highlight the text and convey essential scientific information. For best reproduction, bright, clear colors should be used. Dark colors against a dark background do not reproduce well; please place your color images against a white background wherever possible. Please contact Carol Ann McNelis at 201-748-6009/cmcnelis@wiley.com for further information.
6. Authors are cautioned to type, wherever possible, all mathematical symbols, equations, and formulas. If these must be handwritten, please write clearly in ink and leave ample space above and below for printer's marks. All Greek or unusual symbols should be identified in the margin the first time they are used. Please distinguish in the margins of the manuscript between capital and small letters of the alphabet wherever confusion may arise (e.g., k, K, k). Please underline with a wavy line all vector quantities. Use fractional exponents to avoid radical signs.
7. A covering letter must accompany each submission indicating the name, address, email address, fax, and telephone number of the author to whom all correspondence is to be addressed. An affiliation must be supplied for each author.
8. Due to the speed of publication, no proof will be shown to authors and, therefore, the manuscript must be submitted in final form.
9. The corresponding author will receive six copies of the issue in which their article appears without charge. Reprints can be ordered and purchased by filling out the form provided by the publisher upon receipt of the manuscript. Neither the manuscript nor its figures will be returned following publication unless a request for return is made when the manuscript is originally submitted. Manuscripts and illustrations not conforming to the above requirements will be returned to the author and will have to be resubmitted for a future issue of the journal.
Disk Submission Instructions
Please return your final, revised manuscript on disk as well as hard copy.
The hard copy must match the disk.
The Journal strongly encourages authors to deliver the final, revised version of their accepted manuscripts (text, tables, and, if possible, illustrations) on disk. Given the near-universal use of computer word-processing for manuscript preparation, we anticipate that providing a disk will be convenient for you, and it carries the added advantages of maintaining the integrity of your keystrokes and expediting typesetting. Please return the disk submission slip below with your manuscript and labeled disk(s).
Guidelines for Electronic Submission
Text
Storage medium. 3-1/2" high-density disk in IBM MS-DOS, Windows, or Macintosh format.
Software and format. Microsoft Word 6.0 is preferred, although manuscripts prepared with any other microcomputer word processor are acceptable. Refrain from complex formatting; the Publisher will style your manuscript according to the Journal design specifications. Do not use desktop publishing software such as Aldus PageMaker or Quark XPress. If you prepared your manuscript with one of these programs, export the text to a word processing format. Please make sure your word processing program's "fast save" feature is turned off. Please do not deliver files that contain hidden text: for example, do not use your word processor's automated features to create footnotes or reference lists.
File names. Submit the text and tables of each manuscript as a single file. Name each file with your last name (up to eight letters). Text files should be given the three-letter extension that identifies the file format. Macintosh users should maintain the MS-DOS "eight dot three" file-naming convention.
Labels. Label all disks with your name, the file name, and the word processing program and version used.
Illustrations
All print reproduction requires files for full color images to be in a CMYK color space. If possible, ICC or ColorSync profiles of your output device should accompany all digital image submissions.
Storage medium. Submit as separate files from text files, on separate disks or cartridges. If feasible, full color files should be submitted on separate disks from other image files. 3-1/2" high-density disks, CD, Iomega Zip, and 5 1/4" 44- or 88-MB SyQuest cartridges can be submitted. At authors' request, cartridges and disks will be returned after publication.
Software and format. All illustration files should be in TIFF or EPS (with preview) formats. Do not submit native application formats.
Resolution. Journal quality reproduction will require greyscale and color files at resolutions yielding approximately 300 ppi. Bitmapped line art should be submitted at resolutions yielding 600-1200 ppi. These resolutions refer to the output size of the file; if you anticipate that your images will be enlarged or reduced, resolutions should be adjusted accordingly.
File names. Illustration files should be given the 2- or 3-letter extension that identifies the file format used (i.e., .tif, .eps).
Labels. Label all disks and cartridges with your name, the file names, formats, and compression schemes (if any) used. Hard copy output must accompany all files.
Editorial Board
E D I T O R
Kai Chang
Texas A&M University,
College Station,
Texas
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E D I T O R I A L B O A R D
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G.P. Agrawal
University of Rochester, USA
J. Archer
CSIRO, Australia
I. J. Bahl
M/A-COM, USA
B. Beker
Advanced Micro Devices, Inc., USA
T. M. Benson
University of Nottingham, United Kingdom
P. Bernardi
University of Rome, Italy
S. Betti
Universita degli Studi de L'Aquila, Italy
K. B. Bhasin
NASA Glenn Research Center,
USA
S. Caosi
University of Pavia, Italy
H. J. Caulfield
Diversified Research Corporation, USA
W. Chew
University of Illinois, USA
J. Chrostowski
National Research Council, Canada
R. A. Cryan
University of Wales Swansea, UK
A. A. de Salles
CETUC-PUC, Brazil
U. Efron
Hughes Research Labs, USA
M. Ettenberg
Suzmar, LLC, USA
H. R. Fetterman
UCLA, USA
L. Figueroa
Boeing Co., USA
T. K. Findakly
Hoechst Celanese Corp., USA
N. N. Fomin
Moscow Technical University,
Russia
T. T. Fong
Hughes Aircraft Co., USA
V. Fouad Hanna
University of Paris, France
V.F. Fusco
Queen's University of Belfast, Northern Ireland
P. B. Gallion
ENST, France
F. Gardiol
École Polytechnique Fédérale,
Switzerland
H. Ghafouri-Shiraz
University of Birmingham, England
J. Goel
TRW, USA
P. F. Goldsmith
Cornell University, USA
K. C. Gupta
University of Colorado, USA
G. I. Haddad
University of Michigan, USA
R. C. Hansen
Consultant, USA
A. Hardy
Tel Aviv University, Israel
J. F. Harvey
Army Research Office, USA
P. R. Herczfeld
Drexel University, USA
W. J. R. Hoefer
University of Victoria, Canada
M. Horno
University of Sevilla, Spain
H. C. Huang
Shanghai Science Technology University,
China
C. Jackson
TRW, USA
D. Jackson
University of Houston, USA
R. Jansen
Industrial Microwave and
RF Techniques Inc., Germany
J.M. Jin
University of Ilinois, USA
M.A. Karim
The City University of New York, USA
L. P. B. Katehi
University of Michigan, USA
S. Kawakami
Tohoku University, Japan
E. L. Kollberg
Chalmers University of Technology, Sweden
J. A. Kong
MIT, USA
Y. Konishi
K. Laboratory Co., Ltd., Japan
S. K. Koul
Indian Institute of Technology, India
H. J. Kuno
Quin Star Technology, USA
A. Lakhtakia
Pennsylvania State University, USA
C. H. Lee
University of Maryland, USA
J. N. Lee
Naval Research Labs, USA
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K. F. Lee
University of Mississippi, USA
R. Q. Lee
NASA Glenn Research Center, USA
M. S. Leong
National University of Singapore, Singapore
T. Li
Bell Telephone Labs, USA
C. Lin
Bell Communication Research, USA
J. C. Lin
University of Illinois, USA
W. Lin
Chengdu Institute of Radio Engineering, China
I. V. Lindell
Helsinki University of Technology,
Helsinki, Finland
H. Ling
University of Texas, USA
N.C. Luhmann
University of California at Davis, USA
J. A. G. Malherbe
University of Pretoria, South Africa
M. Marciniak
Institute of Telecommunications, Poland
K. A. Michalski
Texas A & M University, USA
T. Midford
Hughes Aircraft Co., USA
J. W. Mink
North Carolina State University, USA
R. Mittra
Pennsylvania State University, USA
Y. Naito
Tokyo Institute of Technology, Japan
R. Nevels
Texas A & M University, USA
A. I. Nosich
National Academy Science, Ukraine
J. Ojeda-Castaneda
Instituto National de Astrofisica, Mexico
G. Pelosi
University of Florence, Italy
K. Peterman
Technical University, Berlin, Germany
J. Ra
KAIST, Korea
A. Rosen
David Sarnoff Research Center, USA
G. Salmer
Universitéé des Sciences et Techniques,
Lille-Flanders-Artois, France
T.K. Sarkar
Syracuse University, USA
F. K. Schwering
US Army CECOM, USA
A. Seeds
University College London, UK
A. K. Sharma
TRW, USA
L. C. Shen
University of Houston, USA
D. W. Smith
Corning Research Centre, England
B. E. Spielman
Washington University in St. Louis, USA
C. Sun
California Polytechnic State University, USA
H. F. Taylor
Texas A & M University, USA
C. S. Tsai
University of California at Irvine, USA
L. Tsang
University of Washington, USA
H. Q. Tserng
Texas Instruments, USA
J. B. Y. Tsui
Wright-Patterson AFB, USA
A. V. Vorst
Catholic University, Belgium
O. Wada
Kobe University
R. W. Wang
Academia Sinica, China
B. Wilhelmi
Jenoptik AG, Germany
A. G. Williamson
University of Auckland, New Zealand
J. C. Wiltse
Georgia Technology Research Institute, USA
K.L. Wong
National Sun Yat-Sen University, Taiwan
J. Wu
National Taiwan University, Taiwan
K. Wu
Ecole Polytechnique de Montreal, Canada
E. Yamashita
University of Electro-Communications, Japan
S. K. Yao
Optech, USA
H. W. Yen
Hughes Research Labs, USA
F. T. S. Yu
Pennsylvania State University, USA
E. Yung
City University of Hong Kong, Hong Kong
W.X. Zhang
Nanjing, China | |
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