期刊名称:INTERNATIONAL JOURNAL OF SOFTWARE ENGINEERING AND KNOWLEDGE ENGINEERING

ISSN:0218-1940
出版频率:Monthly
出版社:WORLD SCIENTIFIC PUBL CO PTE LTD, 5 TOH TUCK LINK, SINGAPORE, SINGAPORE, 596224
  出版社网址:http://www.worldscinet.com/index.html
期刊网址:http://www.worldscinet.com/ijseke/ijseke.shtml
影响因子:1.47
主题范畴:COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE;    COMPUTER SCIENCE, SOFTWARE ENGINEERING;    ENGINEERING, ELECTRICAL & ELECTRONIC

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

The International Journal of Software Engineering and Knowledge Engineering is intended to serve as a forum for researchers, practitioners, and developers to exchange ideas and results for the advancement of software engineering and knowledge engineering. Three types of papers will be published:

  • Research papers reporting original research results
  • Technology trend surveys reviewing an area of research in software engineering and knowledge engineering
  • Survey articles surveying a broad area in software engineering and knowledge engineering
In addition, tool reviews (no more than three manuscript pages) and book reviews (no more than two manuscript pages) are also welcome.

A central theme of this journal is the interplay between software engineering and knowledge engineering: how knowledge engineering methods can be applied to software engineering, and vice versa. The journal publishes papers in the areas of software engineering methods and practices, object-oriented systems, rapid prototyping, software reuse, cleanroom software engineering, stepwise refinement/enhancement, formal methods of specification, ambiguity in software development, impact of CASE on software development life cycle, knowledge engineering methods and practices, logic programming, expert systems, knowledge-based systems, distributed knowledge-based systems, deductive database systems, knowledge representations, knowledge-based systems in language translation & processing, software and knowledge-ware maintenance, reverse engineering in software design, and applications in various domains of interest.

Abstracting/Indexing

SciSearch®

ISI Alerting Services

CompuMath Citation Index® (CMCI®)

INSPEC

DBLP Bibliography Server

io-port.net

Compendex

Computer Abstracts

 


Instructions to Authors
Four copies of the manuscript including the original (reproductions are acceptable if they are clearly legible), a list of keywords and copies of all figures are required. In addition, one reproducible set of figures (professionally drafted ink originals of line drawings; glossy prints of halftones) will be required if the paper is accepted. Detailed instructions for preparation of manuscripts can be obtained from your nearest World Scientific Office or the Editor-in-Chief.

Electronic submission of accepted manuscripts in TeX, LaTeX or ASCII to the publisher is strongly recommended to expedite publication.

Manuscripts can also be sent to the publisher via Web-based submission.

Detailed instructions for preparation of manuscripts are available in: Latex-2.09 (readme / Download)


Editorial Board

Editor-in-Chief
S K Chang
Knowledge Systems Institute
3420 Main Street
Skokie, IL 60076, USA
Tel: 708-835-1426
Fax: 708-679-3166
E-mail: chang@cs.pitt.edu

Associate Editors
V Berzins (Naval Postgraduate School, Monterey, USA)
A Berztiss (Univ. Pittsburgh, USA)
A Cimitile (Univ. Sannio, Italy)
D E Cooke (Texas Tech. Univ., USA)
Y Deng (Florida Int'l Univ., USA)
D Graupe (Univ. Illinois at Chicago, USA)
L Henschen (Northwestern Univ., USA)
W D Hurley (US WEST Advanced Technologies, USA)
N Juristo (Univ. Politecnica de Madrid, Spain)
B Kraemer (Fern Univ., Germany)
R J Lauber (Univ. Stuttgart, Germany)
C V Ramamoorthy (Univ. California at Berkeley, USA)
R G Reynolds (Wayne State Univ., USA)
G Ruhe (Univ. Calgary, Canada)
M Saeki (Tokyo Institute of Technology, Japan)
R D Semmel (John Hopkins Univ., USA)
P C-Y Sheu (Univ. California at Irvine, USA)
G Weiss (Tech. Univ. Munich, Germany)
K Torii (Nara Institute of Science and Technology, Japan)
G Tortora (Univ. Salerno, Italy)
J J-P Tsai (Univ. Illinois at Chicago, USA)
J E Urban (Arizona State Univ., Tempe, USA)
B W Weide (The Ohio State Univ., USA)
C Yu (Univ. Illinois at Chicago, USA)

Technology Trend Review & Survey Editor
D Hurley (Univ. Pittsburgh, USA)

Book Review Editor
D E Cooke (Texas Tech. Univ., USA)


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