期刊名称：FLEXIBLE AND PRINTED ELECTRONICS ISSN： 2058-8585 出版频率： Quarterly 出版社： IOP PUBLISHING LTD, TEMPLE CIRCUS, TEMPLE WAY, BRISTOL, ENGLAND, BS1 6BE   出版社网址： https://iopscience.iop.org 期刊网址： https://iopscience.iop.org/journal/2058-8585 影响因子： 3.588 主题范畴： MATERIALS SCIENCE, MULTIDISCIPLINARY 变更情况： 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal Scope Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications. For more detail on the subjects covered please see the breakdown below, however this is not exhaustive. If you are unsure if your article is suitable for the journal, please contact the journal team at fpe@iop.org. Materials Printing electronics Design Modelling and reliability of components or systems Advanced fabrication Bioelectronics and stretchable electronics Devices Applications Article types Papers: reports of high-quality original research with conclusions representing a significant advance in the field. Letters: outstanding concise articles, reporting important, new and timely developments. These articles should be deserving of priority review, and you are required to upload a justification statement along with your submission. Focus issue articles: invited articles, which will form a special collection of papers on a specific theme. When asked to select 'Article Type' on the submission system, please select 'Special Issue Article'. Then select the focus issue you're submitting to in the drop down box that appears. Topical reviews: written by leading researchers in their fields, these articles present the background to and overview of a particular field, and the current state of the art. Topical review articles are normally invited by the Editorial Board. Comments: comment or criticism on work published in the journal within the last year. These are usually published with an associated reply. Abstracting and indexing services We work with our authors to help make their work as easy to discover as possible. Flexible and Printed Electronics is currently included in the following abstracting and discovery services: Chemical Abstracts Service Ei Compendex Inspec Scopus Web of Science (Emerging Sources Citation Index) Yewno Unearth   Instructions to Authors https://publishingsupport.iopscience.iop.org/journals/flexible-and-printed-electronics/ Editorial Board Editor-in-Chief   Ronald Österbacka, Åbo Akademi University, Finland Editor for Materials   Jana Zaumseil, University of Heidelberg, Germany Editor for Printing Technologies   Gyoujin Cho, Sungkyunkwan University, Korea Editor for Advanced Fabrication   Michael McAlpine, University of Minnesota, USA Editor for Bioelectronics   Róisín M Owens, University of Cambridge, UK Editor for Design and Properties of Components, Devices and Systems   Xiaojun Guo, Shanghai Jiao Tong University, China Associate Editors Sushmee Badhulika, Indian Institute of Technology, Hyderabad, India Emily Bittle, National Institute of Standards and Technology (NIST), USA Tricia Breen Carmichael, University of Windsor, Canada Taik-Min Lee, Korea Institute of Machinery & Materials (KIMM), Korea Takhee Lee, Seoul National University, Korea Ulrich Lemmer, Karlsruher Institut für Technologie, Germany Tse Nga (Tina) Ng, University of California, San Diego, USA Jonathan Rivnay, Northwestern University, USA Prashant Sonar, Queensland University of Technology, Australia Lirong Zheng, Royal Institute of Technology (KTH), Sweden Flexible and Printed Electronics also has academic and industrial advisory panels.