期刊名称：EURASIP JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING ISSN： 1687-1472 出版频率： Continuous publication 出版社： SPRINGER, ONE NEW YORK PLAZA, SUITE 4600 , NEW YORK, United States, NY, 10004   出版社网址： https://link.springer.com/ 期刊网址： https://link.springer.com/journal/13638 影响因子： 2.455 主题范畴： ENGINEERING, ELECTRICAL & ELECTRONIC;    TELECOMMUNICATIONS 变更情况： 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal EURASIP Journal on Wireless Communications and Networking is a peer-reviewed open access journal published under the brand SpringerOpen. The overall aim of the EURASIP Journal on Wireless Communications and Networking is to bring together science and applications of wireless communications and networking technologies with emphasis on signal processing techniques and tools. It is directed at both practicing engineers and academic researchers. EURASIP Journal on Wireless Communications and Networking will highlight the continued growth and new challenges in wireless technology, for both application development and basic research. Papers should emphasize original results relating to the theory and/or applications of wireless communications and networking. Review articles, especially those emphasizing multidisciplinary views of communications and networking, are also welcome. 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Make sure you are submitting to the most suitable journal - Aims and scope Understand the costs and funding options - Fees and funding Make sure your manuscript is accurate and readable - Language editing Understand the copyright agreement - Copyright   Ready to submit To give your manuscript the best chance of publication, follow these editorial policies and formatting guidelines. EURASIP Journal on Wireless Communications and Networking publishes the following article types: Research Article Review Click the relevant link to find style and formatting information for the article you are going to submit. Formatting rules for Applied Microscopy - Author's checklist General formatting rules for all article types - Prepare your manuscript Make sure your submission is complete - Prepare supporting information Copyright and license agreement - Agree to conditions Read and agree to our Editorial Policies - Editorial Policies   Submit and promote After acceptance, we provide support so your article gains maximum impact in the scientific community and beyond. Who decides whether my work will be accepted? - Peer-review policy Spreading the word - Promoting your publication Submit your manuscript in Editorial Manager Editorial Board Editor-in-Chief Prof. Dr.-Ing. Eduard Jorswieck Univ.-Professor für Theoretische Nachrichtentechnik    Technische Universität Dresden Fakultät für Elektrotechnik und Informationstechnik   Institut für Nachrichtentechnik 01062 Dresden E-Mail: Eduard.Jorswieck@tu-dresden.de Associate Editors Farid Ahmed, Johns Hopkins University Applied Physics Laboratory, USA Giusi Alfano, DISAT Politecnico di Torino, Italy Carles Antón-Haro, Telecommunications Technological Center of Catalonia (CTTC), Spain Kamran Arshad, Ajman University, UAE  Yong Bai, Hainan University, China Marco Baldi, Università Politecnica delle Marche, Italy  Vo Nguyen Quoc Bao, PTIT Posts and Telecommunications Institute of Technology, Vietnam Pan Cao, The University of Edinburgh, United Kingdom Anas Chaaban, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi Arabia Hong-bin Chen, Guilin University of Electronic Technology, China Yuh Shyan Chen, National Taipei University, Taiwan Pascal Chevalier, Thalès-Communications, France Wen-Long Chin, National Cheng Kung University, Taiwan Spyridon K. Chronopoulos, University of Ioannina, Greece Daniel Benevides da Costa, Federal University of Ceara , Brazil Ibrahim Develi, Erciyes University, Turkey Arman Farhang, Maynooth University, Ireland Michael Gastpar, University of California at Berkeley, USA Zabih F. Ghassemlooy, Northumbria University, United Kingdom Filippo Giannetti, Università di Pisa, Italy Anastasios Giovanidis, Marie Curie University, France Gerardo Gómez, ETSI Telecomunicación, Universidad de Málaga, Spain Jean-marie Gorce, Institut National des Sciences Appliquées de Lyon, France Sotirios K. Goudos, Aristotle University of Thessaloniki, Greece Fabrizio Granelli, Università degli Studi di Trento, Italy Francesco Grimaccia, POLITECNICO DI MILANO University, Italy Emanuel Guariglia, University of Naples Federico II, Italy Zehua Guo, University of Minnesota, Minneapolis, US Shengqian Han, Beihang University, China Chunlong He, Shenzhen University, China Shiwen He, Central South University, China Shagufta Henna, Waterford Institute of Technology, Ireland   Yongming Huang, Southeast University, China Yulin Hu, RWTH Aachen University, Germany Min Jia, Harbin Institute of Technology, China Jing Jiang, Durham University, UK Mingye Ji, University of Utah, USA Hamdi Joudeh, Imperial College London, UK Md Jahidur Rahman, Qualcomm Inc., USA Omprakash Kaiwartya, Nottingham Trent University, UK Muhammad Ruhul Amin Khandaker, Heriot-Watt University, UK  Thomas D. Lagkas, The University of Sheffield, Greece Lukas Landau, Center of Telecommunication Studies at PUC-Rio, Brazil Vincent Lau, Hong Kong University of Science and Technology, Hong Kong Tho Le-Ngoc, McGill University, Canada Feng Li, Zhejiang University of Technology, China Chengchao Liang, Carleton University, Canada Lingjia Liu, Virginia Tech, USA Xin Liu, Dalian University of Technology, China Daniel Lucani, Aalborg University, Denmark Nicola Marchetti, Trinity College Dublin, Ireland Roman Maršálek, Brno University of Technology, Czech Republic Rami Mochaourab, KTH Royal Institute of Technology, Sweden Nader Mokari, Tarbiat Modares University, Iran Youssef Nasser, American University of Beirut, Lebanon Duy H. N. Nguyen, San Diego State University, USA Ngoc Tu Nguyen, Missouri University of Science and Technology, USA Giovanni Pau, Kore University, Italy Jordi Pérez-Romero, Universitat Politècnica de Catalunya (UPC), Spain Mylène Pischella, Conservatoire National des Arts et Métiers, France Bhaskar Prasad Rimal, The University of New Mexico, USA Rukhsana Ruby, Shenzhen University, China Panagiotis Sarigiannidis, University of Western Macedonia, Greece Stefan Schwarz, Technische Universität Wien, Austria Dimitrios Skoutas, University of the Aegean Karlovassi, Greece Richard Demo Souza, Federal University of Santa Catarina (UFSC), Florianopolis, SC, Brazil Zhi Sun, University of Buffalo, USA Jie Tang, South China University of Technology, China Stefano Tomasin, University of Padova, Italy Le-Nam Tran, University College Dublin, Ireland Miaowen Wen, South China University of Technology, China Haijun Zhang, University of Science and Technology, China Heng Zhang, Western Sydney University, Australia Qi Zhang, Department of Engineering, Aarhus University, Denmark Caijun Zhong, Zhejiang University, China Huan Zhou, China Three Gorges University, China Zhenyu Zhou, North China Electric Power University, China Nizar Zorba, Qatar University, Qatar