期刊名称:ADVANCED MATERIALS INTERFACES
期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal

Overview
Aims and Scope
Advanced Materials Interfaces publishes top-level research on interface technologies and effects. Considering any interface formed of solids, liquids, and gases, the journal ensures an interdisciplinary blend of Physics, Chemistry, Materials Science, and Life Sciences.
Interfaces play an essential role in virtually all materials and devices. While materials are shrinking, the interface begins to dominate their interesting properties. In a wide variety of applications from corrosion protection to catalysis, progress is guided by a refinement of our understanding of the interface effects. These interfaces may be solid/solid, solid/liquid, solid/gas interfaces or any combination thereof.
With the decrease in size and increase in complexity of materials this already highly interdisciplinary field is now becoming ever more integrated. Physics, chemistry, materials science and life sciences blend to encourage new, cross-pollinating ideas, which will drive forward our understanding of the physics and chemistry at the interface.
Advanced Materials Interfaces provides a forum on topics of surface and interface science with a wide choice of formats: Full Papers, Reviews and Communications, as well as Progress Reports and Research News.
ISSN: 2196-7350 (online). CODEN: AMIDD2.
Volume 3. 18 Issues in 2016.
How to cite: To make sure that references to this journal are correctly recorded and resolved (for example in CrossRef, PubMed, or ISI Web of Knowledge), please use the following abbreviated title in any citations: "Adv. Mater. Interf." (punctuation may vary according to the style of the citing journal).
Readership
Materials scientists, physicists, chemists, engineers, biologists, and polymer scientists from academia and industry
Keywords
Heterogeneous catalysis, surface reactions, biofilms, polymer interfaces, oxide interfaces, layered materials, membranes, thin films, device junctions, photovoltaics, electrochemistry, electrode/molecule contacts, magnetic interfaces, superconducting interfaces, topological insulators, colloidal systems, wetting, adhesion, coatings, lubricants, tribology, adsorption/desorption, diffusion and growth, surface patterning, microelectronics, 2D materials, strongly correlated systems.
Abstracting and Indexing Information
- CAS: Chemical Abstracts Service (ACS)
- Current Contents: Physical, Chemical & Earth Sciences (Thomson Reuters)
- Science Citation Index Expanded (Thomson Reuters)
- SCOPUS (Elsevier)
- Web of Science (Thomson Reuters)
Instructions to Authors
Instructions to Authors
2706_Guide_for_Authors.pdf
Editorial Board
| Executive Board: |
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Hans M. Christen, Oak Ridge National Laboratory |
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Harald Fuchs, University of Münster |
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Karen K. Gleason, Massachusetts Institute of Technology |
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Bartosz A. Grzybowski, Northwestern University |
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Lei Jiang, Institute of Chemistry, Chinese Academy of Sciences |
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Helmut Möhwald, Max-Planck-Institute of Colloids and Interfaces |
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Alexander Shluger, University College London |
| Advisory Board: |
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Yoichi Ando, Osaka University |
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Masakazu Aono, National Institute for Materials Science-Tsukuba |
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Richard Berndt, Christian Albrechts Universität zu Kiel |
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Robert W. Carpick, University of Pennsylvania |
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Lifeng Chi, FUNSOM Institute, Soochow University |
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Paul K. Chu, City University of Hong Kong |
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Ulrike Diebold, Technical University Wien |
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Georg Duesberg, Trinity College Dublin |
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Hongjin Fan, Nanyang Technological University |
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Hongjun Gao, IOP-CAS Beijing |
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Gary Hodes, Weizmann Institute |
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Rene A. J. Janssen, Technical University Eindhoven |
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Pavel Jelinek, Institute of Physics of Czech Academy of Science |
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Mikhail Katsnelson, Radboud University, Nijmegen |
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Mato Knez, nanoGUNE |
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Weimin Liu, Lanzhou Institute of Chemical Physics |
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Rodolfo Miranda, Universidad Autónoma de Madrid |
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Gianfranco Pacchioni, Milano - Bicocca |
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Karsten Reuter, Technical University München |
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Miquel Salmeron, Lawrence Berkeley National Lab |
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Udo Schwingenschlögl, King Abdullah University of Science and Technology (KAUST) |
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Taolei Sun, Wuhan University of Technology |
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Dan Wang, Institute of Process Engineering, Chinese Academy of Sciences |
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Martin Wolf, Fritz Haber Institute, Max Planck Society |
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Han Woong Yeom, POSTECH |
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Kai Wu, Peking University |
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Jimmy Yu, The Chinese University of Hong Kong |
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Han Zuilhof, Wageningen UR |
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Jeong Young Park, SCALE Laboratory, KAIST |
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Xiaohui Qiu, National Center for Nanoscience and Technology - Beijing |
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