期刊名称：INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
 Precision engineering and manufacturing issues are becoming ever more important in current and future technologies. New knowledge in this field will aid in the advancement of various technologies that are needed to gain industrial competitiveness. To this end the International Journal of Precision Engineering and Manufacturing (IJPEM) aims to disseminate relevant fundamental and applied research works of high quality to the international community through efficient and rapid publication.
IJPEM covers original and novel research contributions in all aspects of precision engineering and manufacturing. The journal's specific focus areas include, but are not limited to:
- Precision Manufacturing Processes
- Measurements and Control
- Robotics and Automation
- Manufacturing Systems
- Design and Materials
- Machine Tools
- Nano/Micro Technology
- Biomechanical Engineering
- Rapid Prototyping and Manufacturing
- Green Manufacturing Technology
IJPEM is published monthly. The contents of the journal are classified into three parts: Regular Paper, Short Communication and Review. All papers are peer reviewed by editors and reviewers from all over the world.
Related subjects » Materials - Production & Process Engineering
ABSTRACTED/INDEXED IN
Science Citation Index Expanded (SciSearch), Journal Citation Reports/Science Edition, SCOPUS, INSPEC, Google Scholar, CSA, Academic OneFile, Earthquake Engineering Abstracts, OCLC, SCImago, Summon by Serial Solutions
Instructions to Authors
1. Instruction for submission
- Authors are required to use the template prepared in Microsoft Word format for the International Journal of Precision Engineering and Manufacturing in writing manuscripts, and to submit the complete manuscript to
· http://www.editorialmanager.com/jpem/.
· - Download IJPEM template here
- Style: Manuscript should be submitted in English, and the presentation as well as the grammar should be clear and comprehensive. Manuscripts that are commercial in nature will not be considered. SI units should be used unless to do so is not feasible or would result in a serious loss of clarity.
- Title page listing the paper title, the name(s) of the author(s), and the affiliation of each author. The corresponding author should be identified by #. His/her e-mail, tel., fax number should be listed in the footnote.
- Abstract (200 words maximum) should be a summary of the paper and not an introduction. Because the abstract may be used in abstracting journals, it should be self-contained (i.e., no numerical references) and substantive in nature, presenting concisely the objectives, methodology used, results obtained, and their significance.
- Subject terms or keywords are required, maximum of six in alphabetical order.
- Text should be spaced and typed in accordance with the provided template.
- Equations should be typed. Define characters that might be confused (such as ell/one, nu/vee, or omega/w) at first usage.
- References to published literature must be numbered consecutively in the order of their citation in the text. The number should be written as an upper script. Private communications or unpublished reports should be treated as references. Use the following formats for books or journal articles:
· Books: Author(s) (list last name, then first and middle initials), book title, publisher, city, and year published. When citing a paper chapter in a book, list the chapter in quotes, and the book, plus the page numbers. Example: Hall, J.A., “Robust Regression and Outlier Detection,” John Wiley & Sons, pp.134-150, 1987.
· Journals: Author(s) (list last name, then first and middle initials), paper title in quote, journal name (abbreviate only well-known journals), volume number, issue number, inclusive page numbers, and year published. Example: Bluzer, N. and Jensen, A. S., “Current Readout of Infrared Detectors,” Opt. Eng., Vol.26, No.3, pp.241-248, 1987.
- Footnotes: Use textual footnotes only when necessary to present important documentary or explanatory material whose inclusion in the text would be distracting.
- Figures should be prepared for maximum contrast and care is required to avoid aliasing when printed out. They should be inserted at upper and/or lower positions in the main text. No coloring and unnecessary shading are permitted in figures.
2. Publication charges
- A certain amount of fee per publication will be required. These charges are financial contributions from authors’ institution to help defray the cost of publishing research results.
- Papers submitted from outside of Korea, i.e. written by foreign corresponding author, are exempted from the publication charges temporarily.
· Publication fees:
1. KRW 360,000 for each paper and KRW 100,000 per additional page (over six pages for regular paper and over eight pages for review paper) will be charged.
2. Again, papers submitted from outside of Korea will be exempted from the publication charges temporarily, but USD 50 per additional page (over six pages for regular paper and over eight pages for review paper) will be charged.
3. Publication fees will be charged upon acceptance of paper by editorial board, and authors are asked to complete the payment within 15 days after request.
· Depositor: Korean Society for Precision Engineering
Kookmin Bank: 099-01-0035-663
Woori Bank: 143-136001-01-001
Shinhan Bank: 140-002-205408
Does Springer provide English language support?
Manuscripts that are accepted for publication will be checked by our copyeditors for spelling and formal style. This may not be sufficient if English is not your native language and substantial editing would be required. In that case, you may want to have your manuscript edited by a native speaker prior to submission. A clear and concise language will help editors and reviewers concentrate on the scientific content of your paper and thus smooth the peer review process.
The following editing service provides language editing for scientific articles in all areas Springer publishes in.
Use of an editing service is neither a requirement nor a guarantee of acceptance for publication.
Please contact the editing service directly to make arrangements for editing and payment.
For Authors from China
文章在投稿前进行专业的语言润色将对作者的投稿进程有所帮助。作者可自愿选择使用Springer推荐的编辑服务，使用与否并不作为判断文章是否被录用的依据。提高文章的语言质量将有助于审稿人理解文章的内容，通过对学术内容的判断来决定文章的取舍，而不会因为语言问题导致直接退稿。作者需自行联系Springer推荐的编辑服务公司，协商编辑事宜。
Editorial Board
Editor-in-Chief
Chong-Nam Chu
School of Mechanical and Aerospace Engineering,
Seoul National University,
Seoul, 151-744, Korea
E-mail: cnchu@snu.ac.kr
Co-Editors-In-Chief
David A. Dornfeld
University of California at Berkeley, USA
E-mail: dornfeld@berkeley.edu
Akira Shimokohbe
Tokyo Institute of Technology, Tokyo, Japan
E-mail: shimo@pi.titech.ac.jp/aashimo@gmail.com
Editors
Sung-Hoon Ahn
Seoul National University, Korea
E-mail: ahnsh@snu.ac.kr
Chih-Hsing Chu
National Tsing Hua University, Taiwan
E-mail: chchu@ie.nthu.edu.tw
Daehie Hong
Korea University, Korea
E-mail: dhhong@korea.ac.kr
Dae-Eun Kim
Yonsei University, Korea
E-mail: kimde@yonsei.ac.kr
Patrick Kwon
Michigan State Univesity, USA
Email: pkwon@egr.msu.edu
Choon-Man Lee
Changwon University, Korea
E-mail: cmlee@changwon.ac.kr
Suk Lee
Pusan National University, Korea
E-mail: slee@pusan.ac.kr
Sun-Kyu Lee
GIST, Korea
E-mail: skyee@gist.ac.kr
Hitoshi Ohmori
RIKEN, Japan
E-mail: ohmori@mfl.ne.jp
Kyehan Rhee
Myongji University, Korea
E-mail: khanrhee@mju.ac.kr
Seung-Han Yang
Kyungpook National University, Korea
E-mail: syang@knu.ac.kr
Members of Editorial Board
Dong-Gyu Ahn, Chosun Univ., Korea
Hyeong-Joon Ahn, Soongsil Univ., Korea
Masato Aketagawa, Nagaoka Univ. of Tech., Japan
Paulo J. Bartolo, Polytechnic Institute of Leiria, Portugal
David L. Bourell, Univ. of Texas at Austin, USA
Suk-Won Cha, Seoul National Univ., Korea
Minho Chang, Korea Univ., Korea
Seung-Hwan Chang, Chung-Ang Univ., Korea
Ming Chen, Shanghai Jia Tong Univ., China
Yong Chen, Univ. of Southern California, USA
Kyu Jin Cho, Seoul National Univ., Korea
Junhyuk Choi, KIMM, Korea
Woo Chun Choi, Korea Univ., Korea
Baeksuk Chu, Kumoh National Institute of Tech., Korea
Dooman Chun, Univ. of Ulsan, Korea
Jonathan Colton, Georgia Institute of Tech., USA
Suman Das, Georgia Institute of Tech., USA
Kornel F. Ehmann, Northwestern Univ., USA
Saman K. Halgamuge, Univ. of Melbourne, Australia
Chang-Soo Han, Korea Univ., Korea
Seong-Wook Hong, Kumoh National Institute of Tech., Korea
Sungchul Jee, Dankook Univ., Korea
Jonghan Jin, KRISS, Korea
Seong-Chan Jun, Yonsei Univ., Korea
Seul Jung, Chungnam National Univ., Korea
Yoshiaki Kanamori, Tohoku Univ., Japan
Shiv G. Kappor, Univ. of Illinois, USA
Beomjoon Kim, Univ. of Tokyo, Japan
Beomkeun Kim, Inje Univ., Korea
Byoung Chang Kim, Kyungnam Unv., Korea
Byung-Sub Kim, KIMM, Korea
Dong Sung Kim, Postech, Korea
Gab-Soon Kim, Gyeongsang National Univ., Korea
Gap Kim, Iowa State University, USA
Gyuman Kim, Kyungpook National Univ., Korea
Hansung Kim, Yonsei Univ., Korea
Hong Seok Kim, Seoul National Univ. of Tech., Korea
Jaehwan Kim, Inha Univ., Korea
Jung Kim, KAIST, Korea
Sangwon Lee, Sungkyunkwan Univ., Korea
Se Han Lee, Kyungnam Univ., Korea
Soon-Geul Lee, Kyung Hee Univ., Korea
Y.S. Liao, National Taiwan Univ., Taiwan
Pei-Chun Lin, National Taiwan Univ., Taiwan
Atsushi Matsubara, Kyoto Univ., Japan
Byung-Kwon Min, Yonsei Univ., Korea
Sangkee Min, Univ. of California at Berkeley, USA
Andrew Nee, National Univ. of Singapore, Singapore
William O'Neill, Univ. of Cambridge, UK
Jitendra Pandey, University of Tokushima, Japan
In-Gyu Park, KAIST, Korea
Jahng-Hyon Park, Hanyang Univ., Korea
Shinsuk Park, Korea Univ., Korea
Young-Woo Park, Chungnam National Univ., Korea
Sungsoo Rhim, Kyung Hee Univ., Korea
David Rosen, Georgia Institute of Tech., USA
Kaiji Sato, Tokyo Institute of Technology, Japan
Jongwon Seok, Chung-Ang Univ., Korea
Zhongde Shan, China Academy of Machinery Science and Tech., China
Taehyun Shim, Univ. of Michigan-Dearborn, USA
Shana Smith, National Taiwan Univ., Taiwan
Shozo Takata, Waseda Univ., Japan
Hung-Yin Tsai, National Tsing Hua Univ., Taiwan
Erman Tekkaya, Univ. of Dortmund, Germany
Charlie C. L. Wang, Chinese Univ. of Hong Kong, Hong Kong
Byeng-Dong Youn, Seoul National Univ., Korea
Inchan Youn, KIST, Korea
Wenzeng Zhang, Tsinghua Univ., China
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