期刊名称：ELECTRONIC MATERIALS LETTERS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
Electronic Materials Letters publishes original papers and occasional critical reviews on all aspects of research and technology in electronic materials including electronic, magnetic, photonic, and nanoscale materials. Emphasis is placed on science, technology and applications of materials, especially on the relationships among the processing, structure and properties (mechanical, thermal, chemical, electrical, electronic, electrochemical, magnetic and optical) of materials. The aspects of processing include the thin film, nanostructure fabrication self-assembly, solidification, phase transformation, and bulk, as well as related with thermodynamic, kinetics and modeling.
Instructions to Authors
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Electronic Materials Letters invites original research reports and review articles related to the |
| topics of electronic, magnetic, and photonic materials. |
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Submission: Manuscripts prepared either in Korean or English should be submitted online at the | |
journal homepage ( http://www.kim.or.kr ) in the form of a single file containing the following materials in the order shown: | |
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(1) Title, Authors, Affiliations, Abstract and Keywords. | |
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(2) Main text of the manuscript. | |
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(3) Acknowledgments and References. | |
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(4) Tables captions and Tables, Figure captions and Figures. | |
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The length of a manuscript should not exceed ten journal pages. | |
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Prior Publication: Submission of a manuscript is representation that the work reported therein | |
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has neither been copyrighted, published, nor submitted for publication elsewhere in any other medium, including electronic journals and computer databases of a public nature. Prior publication is a basis for rejection. Appearance in conference proceedings is not necessarily regarded as a prior publication. |
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Review Process: Two qualified reviewers, designated by an editor or an associate editor, would | |
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judge the submitted manuscript based on its technical merit according to established procedure. The editor makes a final decision on the paper based on the review results within 4 weeks of submission. |
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The Accepted Mauscript should carefully be proofread by the authors before publication and | |
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will not be returned to the author, unless requested otherwise. The authors are entitled to 20 reprints without additional charge, but are charged for excess reprints exceeding 20 in addition to the nominal publication charge. |
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The Title should be concise but informative enough to facilitate information retrieval. The first | |
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letter of each word should begin with a capital letter except for articles, conjunctions, and prepositions. The first word after a hypen should also be capitalized such as Temperature-Dependent Mobility, The X-Ray Diffraction, and Tin-Lead Solder. |
Bylines should include all those who have made substantial contributions to the work. The first | |
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author should be the major contributor of the work. All authors' names should be written in full except for non-Koreans. At least one author should be designated with a sign as the corresponding author. |
Affiliations should include the following information in the order of Institute, Department, City, Zip- | |
| Code, and Country. |
Abstracts should not exceed 150 words. Up to 6 representative keywords can be included.
Text should be written as concisely as possible. | |
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(1) The International System of Units (SI) should be employed throughout the text. | |
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(2) Abbreviations should be defined the first time they occur in manuscript. Defined abbreviations must then be used in the pre-described form.
Example: Absolute temperature (T) is ��?T is | |
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(3) The mathematical equations are expressed in italic type, numbering the equations consecutively throughout the text with algebraic numerals in parentheses such as (1), (2), and (3), etc. without connecting lines after the equations. | |
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(4) Simple equations can be expressed in one line using slashes with parenthesis,
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Example: |
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can be represented as (a+b)/(c+d).
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(5) Tables and Figures must be accompanied by the table and figure captions above the desc- | |
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ribing captions above the describing tables and below the corresponding figures, respectively. The size of figures and photographs should be between 80 and 170 mm in width. |
References must be numbered through the manuscript in solid bracket, e.g. [1.2] or [1-6] and | |
presented in consecutive numerical order on the reference page. For the journal abbreviations, refer to table 1 of Electronic Materials Letters submission instructions in the journal homepage ( http://www.kim.or.kr ). Type all the references in the corresponding format given below; |
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[Styling of References] |
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(1) Journals: Author, Journal Title Vol., page (year). | |
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��?S.C. Han , D.Y. Yoon, and M.K. Byun, Electron Mater. Lett. 43, 977 (2005). | |
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��?S.Jin, Electron. Mater. Lett. (in Press). | |
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(2) Conference Proceedings or Books : Author, Proceeding (editor) or Book, page, publisher, place (year). | |
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��?T. K. Ha and Y. W. Chang, Proc. 2 nd Pacific Rim Int. Conf. on Adv. Mater. & Processing (eds. K. S. Shin, J. K. Yoon, and S. J. Kim), p.253, Korean Inst. Metals & Mater., Gyongju, Korea (1995). | |
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��?D. V. Morgan and K. Board, An Introduction to Semiconductor Microtechnology, 2 nd ed., p.1-13, John Wiley & Sons, Chichester (1995). | |
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(3) Web-page : Author, Title, URL (year). | |
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(4) Thesis : Author, Thesis, page, university, place (year). | |
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��?C.H. Kim, Ph. D. Thesis, p. 97-116, Daehan University, Seoul (2004). | |
Instructions to Authors
instructions_for_authors_elec.pdf
Editorial Board
Editor-in-Chief
Seung-Ki Joo (Seoul National University)
Editors
Byung Tae Ahn (KAIST)
Young-Ho Kim (Hanyang University)
Young Keun Kim (Korea University)
Dae-Hong Ko (Yonsei University)
Jang-Sik Lee (Kookmin University)
Kyung-Ho Shin (KIST)
Ji-Beom Yoo (Sungkyunkwan University)
International Advisory Board
Chang-Beom Eom (University of Wisconsin Madison)
Seung H. Kang (Qualcomm)
Choong-Un Kim (University of Texas at Arlington )
Jiyoung Kim (University of Texas at Dallas)
Editorial Committee
http://www.kim.or.kr
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