期刊名称：JOURNAL OF ELECTRONIC MATERIALS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
The Journal of Electronic Materials (JEM) is a monthly archival publication that reports on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, insulators, and optical and display materials. Published by The Minerals, Metals & Materials Society (TMS) and the Institute of Electrical and Electronics Engineers (IEEE) for the past 25 years, JEM strives to publish papers of interest to both nonspecialists and specialists in the electronic materials field.
Instructions to Authors
Anyone wishing to publish in JEM should adhere to the instructions set forth in the Author Guidelines. The guidelines detail communication contacts and manuscript preparation. Generally, three copies of a manuscript are sent to the appropriate section or associate editor. Manuscripts dealing with subjects not identified with any particular section or associate editor should be sent to Theodore C. Harman.
For letters only, fax one copy to B.W. Wessels and mail two copies, one of which includes glossy prints or an equivalent. Priority mail is recommended for shortened publication times. Each submitted letter (up to six double-spaced pages and up to four figures and/or tables) should be accompanied with an abstract of 100 words or less, a key words line, and a transfer of copyright form. The initial submission should state that the contribution is for the Letters section.
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General Purpose
The Journal of Electronic Materials (JEM) is published by the Electronic, Magnetics & Photonic Materials Division of The Minerals, Metals & Materials Society (TMS) and the Electron Devices Society of the Institute of Electrical and Electronics Engineers. JEM regularly reports on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, insulators, and optical and display materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, and electronic properties of these materials. Specific areas of interest are electronic memory and logic structures, magnetic-optical recording media, superlattices, packaging, detectors, emitters, metallization technology, superconductors, and low thermal-budget processing. The journal also selectively publishes invited and contributed review papers on topics of current interest to enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. Further, JEM publishes selected papers from conferences sponsored by the TMS Electronic, Magnetics & Photonic Materials Committee (e.g. the Electronic Materials Conference). It is the journal's editorial intent that the published papers be of interest to nonspecialists and specialists in the field of the particular contribution.
To better understand the type of material the journal publishes, review the table of contents and abstracts from previous issues as well as the listing of upcoming editorial topics.
Forms of Publication
The journal classifies paper submissions as
- Regular Issue Papers: Full-length manuscripts that deal with new and original research work.
- Letters: Brief research papers.
- Reviews: Lengthy papers which cover a specific area of research in great depth.
- Special Issue Papers: Ten or more new and original research papers on the same topic usually originating from the same technical conference that are presented in the same issue.
- Special Section Papers: Six to nine papers concerned with research on the same topic.
Manuscript Review Process
All submissions require an abstract of 100 words or less, a key words line, a transfer of copyright form, and an electronic file. Papers are reviewed by two qualified referees to determine suitability. The editor¡¯s decision to accept or reject a paper, based on referees¡¯ comments, is final. Please employ the following guidelines when submitting a paper for review:
- Manuscripts, written in English, should be in a single column and formatted to fit on a 22 x 28 cm sheet.
- The title of the article and abstract should be separate from the text. References, figure captions, and tables should also be on separate pages.
- The work¡¯s significance and its relation to the work of others should be detailed in the ¡°Introduction¡±. Major assumptions should be stated and procedures adequately outlined.
- References should be cited by Arabic numbers as superscripts. Include the names of all authors, standard abbreviated name of journal [see, for example, http://www.library/caltech.edu/admin/abbreviations/ or World List of Scientific Periodicals, 4th ed. (1960), Butterworths, London], the volume number, initial page number, and year of publication in parenthesis. For books, include city of publication and publisher.
- Measurements should be given in metric units.
Only manuscripts submitted through the on-line system at http://jem.electronicipc.com will be considered for publication.
All reviews for electronically submitted manuscripts occur on-line in a secure environment. Letters and comments concerning the papers are transmitted via e-mail to the corresponding author.
Manuscript Preparation for Publication
After an author's paper passes the review process, it is necessary to prepare the manuscript for publication. Authors of accepted manuscripts are required to submit the final version of the manuscript (text, tables, references, and figures) on a disk or CD-ROM (in addition to a hard copy with original figures). Indicate software type and version used (e.g., Microsoft Word version 6.0). Do not send PDF files.
ArtworkIt is especially important that one's artwork be of publication quality. Some specifics regarding the figures for your manuscript are:
- Do not embed figures in the document.
- Include original glossy prints for all figures. (Micrographs printed on plain paper are not high resolution.)
- Each figure must be submitted in a separate TIFF or EPS file.
- If images are color or grayscale, the resolution should be 300 dots-per-inch (dpi). Black-and-white line art should be 600 dpi. Figures should be at least 11.5 cm (4.5 inches, 324 points, 27 picas) wide.
- Indicate which, if any, figures are to be reproduced in color. All figures will be reproduced in black and white unless the contact author indicates otherwise. Authors incur the cost of color printing.
- Failure to follow these guidelines will delay the publication of your paper.
Authors are instructed where to submit the publication-quality manuscript when the reviewed paper is accepted.
Copyright
Submission is a representation that the manuscript has not been previously published and is not currently under consideration for publication elsewhere. A statement transferring copyright to TMS is required before the manuscript can be accepted for publication. Copyright transfer forms are periodically printed with JEM and may also be downloaded in portable document format and viewed using Adobe Acrobat.
Page Proofs
Only the primary ¡°corresponding¡± author will be given an opportunity to review the manuscript before publication. Turnaround time is short (~2 days). The review of the proof copy should be solely dedicated to detecting typographical errors. Changes to figures at this time are strongly discouraged and may result in a back-charge to the authors.
Page Charges and Reprints
JEM, like many other scientific and technical journals, depends on author page charges for a significant part of its support. Therefore, a charge of $110 per printed page is levied for all papers published. One hundred reprints will be supplied without additional charge for every paper on which the payment of these charges is authorized. Waivers of all or part of the page charges require written request. Inquiries relative to page charges, waivers, and reprints should be directed to: JEM Circulation Department, TMS, 184 Thorn Hill Road, Warrendale, PA 15086; (724) 776-9000, ext. 214; fax (724) 776-3770. |
Editorial Board
EDITOR
Theodore C. Harman
Lincoln Laboratory
Massachusetts Institute of Technology
244 Wood Street, Lexington
Massachusetts 02420-9108
telephone (781)981-4418; fax (718) 981-0122
e-mail tharman@11.mit.edu.
- SECTION EDITORS
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- L.J. Brillson
Electronic Materials Reviews
Ohio State University
205 Dreese Laboratory, Neil Avenue
Columbus, Ohio 43210-1272
telephone (614)292-8015; fax (614) 292-7596
e-mail brillson.1@osu.edu
B.W. Wessels
Electronic Materials Letters
Dept. of Materials Science and Engineering,
Northwestern University
2225 N. Campus Drive, Evanston, Illinois 60208
telephone (847) 491-3219; fax (847) 491-7820
e-mail wessels@igor.tech.northwestern.edu
BOARD OF ASSOCIATE EDITORS
Susan E. Babcock
Defects and Microstructure
University of Wisconsin-Madison
Dept. of Materials Science & Eng.
1509 University Avenue, Madison, WI 53706-1595
telephone (608) 263-5696; fax (608) 262-8353
e-mail babcock@engr.wisc.edu
L.J. Brillson
Interfaces and Contacts
Ohio State University, 205 Dreese Laboratory
Neil Avenue, Columbus, Ohio 43210-1272
telephone (614) 292-8015; fax (614) 292-7596
e-mail brillson.1@osu.edu
Kurt G. Eyink
Materials Integration
Wright-Patterson Air Force Base
Bldg. 652, Room 131
3005 Hobson Way
WPAFB, OH 45433-7707
telephone (937) 656-5710; fax (937) 656-7788
e-mail kurt.eyink@wpafb.af.mil
Darrel Frear
Packaging and Interconnects
Motorola, Semiconductor Product Systems
MD-EL725, 2100 E. Elliot Road, Tempe, Arizona 85284
telephone (602) 413-6655; fax (602) 413-4511
e-mail darrel.frear@motorola.com.
Rachel S. Goldman
Defects and Nanocharacterization
University of Michigan
Dept. of Materials Science & Eng.
2300 Hayward Street, Ann Arbor, MI 48109-2136
telephone (734) 647-6821; fax (734) 763-4788
e-mail rsbold@engin.umich.edu.
Pat Lenahan
Dielectrics and Ferroelectrics
Pennsylvania State University
Dept. ESM, 227 Hammond Bldg., University Park, Pennsylvania 16802
telephone (814) 863-4630; fax (814) 863-7967
e-mail pmlesm@engr.psu.edu
Suzanne Mohney
Compound Semiconductor Growth II
The Pennsylvania State University
Materials Science and Engineering
109 Steidle Building
University Park, PA 16802
telephone (814) 863-0744; fax (814) 865-2917
e-mail mohney@ems.psu.edu
William C. Mitchel
Electronic & Optical Characterization
Air Force Research Laboratory
AFRL/MLPS
3005 P St., Rm. 243
Wright Patterson AFB, Ohio 45433-7707
telephone (937)255-4474; fax (937)2555-4913
Richard P. Schneider
Compound Semiconductor Growth II
Infinera
1322 Bordeaux Road
Sunnyvale, California 95089
telephone (408) 572-5429; fax (408) 572-5343
e-mail rschneider@infinera.net
Michael Tischler
Silicon-Based Heterostructures
OCIS Tech
1401 W. Saltsage Dr.
Phoenix, Arizona 85045
telephone/fax (480) 283-0858
e-mail tisch@ocistech.com
Kazumi Wada
Silicon Processing and Characterization
MIT Dept. of Materials Science & Engineering
77 Massachusetts Avenue, Room 13-4110, Cambridge, Massachusetts 02139
telephone (617) 252-1104; fax (617) 253-6782
email kwada@mit.edu
EDITORIAL BOARD
L.J. Guido
Virginia Tech
Dept. of Materials Science and Engineering
Blacksburg, VA 24061;
telephone (540) 231-3551; fax (540)231-8919
e-mail louis.guido@vt.edu.
James L. Merz
University of Notre Dame
203 B Cushing Hall
Notre Dame, IN 46556-5637
telephone (574)631-3111; fax (574) 631-0651
e-mail jmerz@nd.edu.
Laura S. Rea
AFRL/MLPS
Sensor Materials Branch
3005 P St. Room 243, WPAFB, Ohio 45433-7707
telephone: 937.255.4474 ext 3213; fax: 937.255.4913
e-mail: laura.rea@wpafb.af.mil
T.D. Sands
University of California
559 Evans Hall, Dept. of MSME
Berkeley, California 94720-1760
telephone (510) 642-2347; fax (510) 643-5792
e-mail sands@uclink.berkeley.edu.
Andrew J. Steckl
University of Cincinnati
Nanoelectronics Laboratory
899 Rhodes Hall
Cincinnati, Ohio 45221-0030
telephone (513) 556-4777; fax (513) 556-7326
e-mail a.steckl@uc.edu
Jerry M. Woodall
Yale University
Department of Electrical Engineering
513 Becton Center 15 Prospect St.
PO Box 208284 New Haven, Connecticut 06520-8284
telephone (203) 432-4298; fax (203) 432-6420
e-mail: jerry.woodall@yale.edu
PRODUCTION EDITOR
Shirley A. Litzinger
TMS, 184 Thorn Hill Road, Warrendale, Pennsylvania 15086; telephone (724) 776-9000, ext. 228; fax (724) 776-3770; e-mail litzinger@tms.org.
MANAGER, GRAPHIC ARTS
Dane Semonian
TMS, 184 Thorn Hill Road, Warrendale, Pennsylvania 15086; telephone (724) 776-9000, ext. 218; fax (724) 776-3770; e-mail semonian@tms.org
SUBSCRIPTIONS
Mark Cirelli
TMS Subscriptions--TMS, 184 Thorn Hill Road, Warrendale, Pennsylvania 15086; telephone (724) 776-9000, ext. 251; fax (724) 776-3770; e-mail subscriptions@tms.org.
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