期刊名称：IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
IEEE Transactions on Semiconductor Manufacturing is ranked #1 for citations in the field of Engineering and Manufarcturing (source: ISI's Journal Citation Report, 2000). Papers describing techniques used in solving the challenging problems of manufacturing complex microelectronic components. The spectrum of coverage ranges from fundamental to applied.
Instructions to Authors
It is anticipated that submitted papers will deal with components and devices, materials, reliability and failure modes, and other topics above. Material must be of archival quality and represent new developments and/or directions in packaging technology, or clear advances in existing technology. In recognition of the large "practitioner" audience for these TRANSACTIONS, authors of submitted manuscripts should take pains to make very clear how the manuscript subject extends the knowledge base in the field of technologies underlying components and packaging.
In some cases, a manuscript submitted to our Editor may have been previously presented at a conference. This does not disqualify the paper, and we would be pleased to consider it; please advise us the name and dates of the conference when you submit your manuscript. Papers that have been previously published in another archival journal should not be submitted to us for review and inclusion in this archival journal.
Please see our Style guide regarding creating a double-spaced version in 10-point type, then converting it to Postscript or PDF, for our review process.
Editorial Board
Editor: Prof. Duane Boning
Massachusetts Institute of Technology
Dept. of Electrical Engineering and Computer Science
Microsystems Technology Laboratories
Room 39-567
60 Vassar Street
Cambridge, MA 02139 USA
telephone: +1-617-253-0931
email: boning@mtl.mit.edu
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