期刊名称:IEEE TRANSACTIONS ON FUZZY SYSTEMS

ISSN:1063-6706
版本:SCI-CDE
出版频率:Monthly
出版社:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
  出版社网址:http://ieeexplore.ieee.org/Xplore/dynhome.jsp
期刊网址:http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=91
影响因子:12.029
主题范畴:COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE;    ENGINEERING, ELECTRICAL & ELECTRONIC

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

 

IEEE TRANSACTIONS ON FUZZY SYSTEMS is published by the IEEE Neural Networks Society on behalf of the following 11 Societies: Circuits and Systems; Computer Society; Control Systems; Engineering in Medicine and Biology; Industrial Electronics; Industry Applications; Lasers and Electro-Optics; Power Engineering; Robotics and Automation; Signal Processing; and Systems, Man, and Cybernetics. Members of sponsoring IEEE Societies may subscribe to this TRANSACTIONS for $19 per year. Members of other IEEE Societies may subscribe for $20 per year. For information on receiving this TRANSACTIONS, write to the IEEE Service Center at the address below. Member copies of Transactions/Journals are for personal use only. 

The IEEE Transactions on Fuzzy Systems (TFS) is published quarterly. TFS will consider papers that deal with the theory, design or an application of fuzzy systems ranging from hardware to software. Authors are encouraged to submit articles, which disclose significant technical achievements, exploratory developments, or performance studies of fielded systems based on fuzzy models. Emphasis will be given to engineering applications.


Instructions to Authors

 

TFS will consider papers that deal with the theory, design or an application of fuzzy systems ranging from hardware to software. Authors are encouraged to submit articles which disclose significant technical achievements, exploratory developments, or performance studies of fielded systems based on fuzzy models. Emphasis will be given to engineering applications.

Types of Contributions

TFS publishes two types of articles: full papers and letters. Full papers are characterized by a comprehensive (and well-written) exposition of an important topic. Major new results are described and analyzed. Certain application-type manuscripts can be full papers if they represent solutions to a major real world problem and contain detailed analysis. The term "letters" will be reserved for just that, i.e., mostly for "comments on" and the authors' response, along with occasional letters to, or interesting tidbits for, the TFS readership. Review management for full papers is under the direction of an associate editor, who will normally solicit four reviews and wait for at least three responses before a decision is reached. The review process is different for letters. An appropriate Associate Editor will assist the EIC in checking that the letter is "reasonable" (particularly for "comments on"). If there is contention, the AE will solicit additional review. Then the EIC will make the acceptance decision. For "Comments on", the original author will be asked for a response. To avoid delay in processing your paper, please follow these guidelines.

Submission of Manuscripts

All correspondence concerning submissions is between the author and the Editor-in-Chief. There are two methods to submit manuscripts to TFS: Paper copies by mail and electronic submission of PDF files. For standard hard copy submission send six (6) copies of your article to the Editor:

Jim Keller
Department of Computer Engineering and Computer Science
University of Missouri
Columbia, MO 65211-2060 USA
phone: (573) 882-7339
fax: (573) 882-8318
email: Kellerj@missouri.edu

Do not send originals of illustrations, figures, and photographs unless you do not need them returned. Enclose a separate signed letter that indicates the address, including phone, fax, and electronic mail, of the corresponding author. In addition, please be ready to transmit a text version of the abstract and reference list upon request by e-mail to assist in speeding up the review process. TFS will accept electronic submissions under the following conditions. Only Portable Document Format (.pdf) files will be accepted. Send two files: the manuscript and the cover letter. The manuscript must be named manuscript.pdf (e.g., Keller .J .manuscript.pdf) and the cover letter named submission.pdf (e.g., Keller.J.submission.pdf). It must be sent to ieeetfs@missouri.edu. DO NOT send the files to my personal e-mail address. If we can open and print your files (be sure to format them for 8.5x11" paper), they will get logged into the database and sent to the appropriate Associate Editor, electronically whenever possible. This TRANSACTIONS is primarily devoted to archival reports of work that have not been--in the main--published elsewhere. Specifically, conference records and book chapters that have been published are not acceptable unless and until they have been significantly enhanced. In special circumstances or on exceptional occasions, the editor may deem a contribution noteworthy enough to be exempted from this policy. Your letter must state that the work being submitted has not been published elsewhere nor is it currently under review by another publication. If either of these conditions is not met or is subsequently violated, your article will be disqualified from possible publication in TFS.

Style for Manuscript

This TRANSACTIONS follows the format standards of the IEEE. The booklet "Information for IEEE Transactions and Journals Authors" is available on request from the IEEE Transactions/Journals Department, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331 or e-mail "trans@ieee.org" or FAX 732?62?545. Here are some guidelines. A list of 20 keywords and an abstract (described below) are required for all manuscripts submitted to this journal. Double space and number all pages, use one side only. Provide an abstract of 10000 words that is an informative summary of the paper, including any important results found or conclusions drawn. Authors are encouraged to put detailed derivations in appendixes. Except in unusual cases, manuscripts over 35 pages, typed double spaced, including figures, appendices, etc., will not be accepted for review.

Page Charges

After a manuscript has been accepted for publication, the author's company or institution will be requested to pay a charge of $110 per printed page to cover part of the cost of publication. Page charges for this TRANSACTIONS, like those for journals of other professional societies, are not obligatory nor is their payment a prerequisite for publication. The author will receive 100 free reprints without covers if the page charge is honored.

Copyright

It is the policy of the IEEE to own copyright to the technical contributions it publishes. To comply with the IEEE copyright policy, authors are required to sign the IEEE Copyright Transfer Form before publication in either the print or electronic medium. The form is provided upon approval of the manuscript. Authors must submit a signed copy of this form with their manuscripts.

Submission of Final Manuscript

Page Numbers: Number all pages, including illustrations (which should be grouped at the end), in a single series, with no omitted numbers. Figures should be identified with the figure number and author's name at the bottom or on the back; keep the information in the margin, off the body of the figure.

References and Captions: Put references on a separate page and provide them in IEEE style. Figure captions should also be on a separate page from references and content. Do not include captions on the illustrations themselves. Figure captions should be sufficiently clear so that the figures can be understood without detailed reference to the accompanying text. Axes of graphs should have self-explanatory labels, not just symbols.

Illustrations and Photos: Figures and photos should be original proofs and not Xeroxes. Photos must be glossy prints with no screens. Laser prints are not acceptable in place of photos or where gray-scale graphics are involved. All line drawing and photos should be in black and white, unless specifically requested. Letters should be large enough to be readily legible when the drawing is reduced to two or one-column width -- as much as 4:1 reduction from the original. All materials should be no larger than 22 x 28 cm (8 1/2 x 11"). Do not incorporate electronic graphics into your paper.

Electronic Form for Final Printing: For the final printed production of the manuscript, the author will need to provide a disk (5 1/4 or 3 1/2") and two paper copies of the peer approved version. Please be certain that changes made to your paper version are incorporated into your disk version, and include an ASCII version of the file. Note the operating system (DOS, Mac, UNIX, etc.) and the software used on the label of the disk. Check that your files are complete including abstract, text, references, footnotes, biographies, and figures captions. IEEE can process most commercial software programs, but not page layout programs. Do not send postscript files. The preferred programs are TeX, LaTeX, and WordPerfect. (Use standard macros.) An IEEE LaTeX style file can be obtained by e-mail at "help@ep.ieee.org". A more complete IEEE Authors Electronic Guide can be obtained by e-mail at "help@ep.ieee.org" or by FAX at 732-62-545.


Editorial Board

Jim Keller, Editor
Computer Engineering and Computer Science Department
217 Engineering Building West
University of Missouri-Columbia
Columbia, MO 65211-2060, USA
phone: (573) 882-7339
fax: (573) 882-8318
email: keller@cecs.missouri.edu
http://sun16.cecs.missouri.edu/

Founding Editor

JAMES C. BEZDEK
Comput. Sci. Dept.
Univ. of West Florida
11000 Univ. Parkway
Pensacola, FL 32514

Associate Editors
ROBERT BABUSKA
Delft Univ. of Technol.
Dept. Elect. Eng.
Mekelweg 4, P.O. Box 5031
2600 GA Delft
The Netherlands

JAMES C. BEZDEK
Comput. Sci. Dept.
Univ. of West Florida
11000 Univ. Parkway
Pensacola, FL 32514

Z. ZENN BIEN
Dean, College of Eng., KAIST
Dept. of Elect. Eng., KAIST
373-1 Kunsung-dong
Yusung-gu
Taejon 305-701 Korea

BOR-SEN CHEN
Dept. of Elect. Eng.
National Tsing Hua Univ.
Hsinchu 30013, Taiwan, R.O.C.

VALERIE CROSS
Computer Science and Systems Analysis
Miami University
Oxford, OH 45056

PHIL DIAMOND
Dept. of Mathematics
University of Queensland
Brisbane, Queensland 4072
Australia

GARY FENG
Dept. of MEEM
City Univ. of Hong Kong
Kowloon, Hong Kong

DIMITAR P. FILEV
Ford Motor Company
24500 Glendale Ave.
Detroit, MI 48239

TOSHIO FUKUDA
Dept. Mechanical Eng.
Nagoya Univ.
Furo-cho, Chikusa-ku
Nagoya, 464-8603, Japan

MICHEL GRABISCH
Lab. d'Informatique de Paris VI (LIP6)
Univ. Pierre et Marie Curie
75015 Paris, France

JANOS L. GRANTNER
Dept. Elect. & Comput. Eng.
3058 Kohrman Hall
Western Michigan Univ.
Kalamazoo, MI 49008-5066

LARRY HALL
Dept. Comput. Sci. and Eng.
Univ. of South Florida
Tampa, FL 33620

NICOLAOS KARAYIANNIS
Dept. Elect. & Comput. Eng.
Univ. of Houston
Houston,TX 77204-4793

UZAY KAYMAK
Erasmus Univ. Rotterdam
Faculty of Economics
Dept. of Comput. Sci.
P.O. Box 1738,
3000 DR Rotterdam
The Netherlands

DONALD H. KRAFT
Dept. Comput. Sci.,
298 Coates Hall
Louisiana State Univ.
Baton Rouge, LA 70803-4020

RAGHU KRISHNAPURAM
IBM India Research Labs, Block I
Indian Institute of Technology
Hauz Khas
New Delhi 110016 India

RUDOLF KRUSE
Otto von Guericke Univ. Magdeburg
Faculty Comput. Sci.
Universitaetsplatz 2
D-39106 Magdeburg, Germany

NAOYUKI KUBOTA
Dept. Human and Artificial
Intelligent Systems
Fukui Univ., 3-9-1 Bunkyo
Fukui 910-8507, Japan

REZA LANGARI
Dept. of Mechanical Eng.
Texas A&M Univ.
College Station, TX 77843-3123

CHIN-TENG LIN
Dept. of Electrical and Control Eng.
National Chiao-Tung Univ.
Hsinchu, Taiwan

BAODING LIU
Dept. of Math. Sciences
Tsinghua Univ.
Beijing 100084 P.R.C.

ZHI-QIANG LIU
Dept. Comput. Sci.
Univ. of Melbourne
Parkville, Victoria, 3052
Australia

PASCAL MATSAKIS
Dept. CIS
Univ. of Guelph
Guelph, ON N1G 2W1, Canada

JERRY MENDEL
Signal & Image Proc. Instit.
Univ. of Southern Calif.
3740 McClintock Ave.
EEB 400
Los Angeles, CA 90089

RALF MIKUT
Karlsruhe Research Center
Inst. Appl. Comput. Sci.
P. O. Box 3640
D-76021
Karlsruhe, Germany

NIKHIL R. PAL
Elect. & Commun. Sci. Unit
Indian Statistical Instit.
203 BT Road
Calcutta 700035, India

RAINER PALM
Siemens AG R&D, ZT IK4
Otto-Hahn-Ring 6
D-81730 Munich, Germany

MAREK J. PATYRA
RA2-401
Intel Corp.
2501 NW 229th Ave.
Hillsboro, OR 97124

WITOLD PEDRYCZ
Elect. & Comput. Eng. Dept.
Univ. of Alberta
Edmonton, Alberta T6G 2G6,
Canada

FRED PETRY
Elect. Eng & Comput. Sci. Dept.
Tulane Univ.
New Orleans, LA 70118

ARTHUR RAMER
Comput. Sci. & Eng.
Univ. of New South Wales
Sydney 2052, Australia

JOAO MIGUEL DA COSTA SOUSA
Technical Univ. of Lisbon
Instituto Superior Tecnico
Dept. of Mechanical Eng./GCAR
Pav. Eng. Mecanica III
1049-001 Lisbon, Portugal

THOMAS SUDKAMP
Dept. Comput. Sci. & Eng.
Wright State Univ.
Dayton, OH 45385

GEORGE VACHTSEVANOS
School of Elect. and Comput. Eng.
Georgia Institute of Technology
Atlanta, GA 30332-0250

LI-XIN WANG
EEE Dept.
Hong Kong Univ. of Sci./Tech.
Clear Water Bay, Kowloon
Hong Kong

Executive Advisory Board
HAMID BERENJI
Intell. Inference Syst.

DIDIER DUBOIS
Univ. Paul Sabatier

MADAN GUPTA
Univ. of Saskatchewan

LAKHMI C. JAIN
Univ. of South Australia, Adelaide

ABRAHAM KANDEL
Univ. of South Florida

GEORGE KLIR
SUNY at Binghamton

BART KOSKO
Univ. of Southern California

ROBERT LEA
LinCom Corp.

SANKAR K. PAL
Indian Statistical Instit.

HENRI PRADE
Univ. Paul Sabatier

ENRIQUE RUSPINI
SRI International

ELIE SANCHEZ
Univ. of Marseille

SAMEER SINGH
Univ. of Exeter

PHILIPPE SMETS
Univ. Libre de Bruxelles

MICHIO-SUGENO
Tokyo Inst. of Technol.

TOSHIRO TERANO
Hosei Univ.

MASAKI TOGAI
Togai Infralogic

RICHARD TONG
Advanced Decision Syst.

ENRIC TRILLAS
Univ. Politech. Madrid

RONALD YAGER
Intell. Inference Syst.

TAKESHI YAMAKAWA
Kyushu Inst. of Technol.

LOTFI ZADEH
Univ. of Calif. Berkeley

HANS ZIMMERMANN
RWTH Aachen


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